Research Triangle Park, N.C. (January 22, 2007) – Nextreme Thermal Solutions has recently named Dr. Phil Deane as Senior Technology Fellow. Dr. Deane, formerly the Director of Packaging for the Advanced Optoelectronic Components Group at JDS Uniphase, joins Nextreme to address thermal management and thermoelectric packaging issues. Dr. Deane will define product and packaging strategies for insertion of Nextreme thermoelectric coolers into customer’s products.
“Dr. Deane is a luminary in his field. With his wealth of advanced packaging and interconnect knowledge in both the electronic components and optoelectronic components arenas, he will be instrumental in developing new packaging solutions to solve our customers’ most challenging thermal problems,” said Dr. Jesko von Windheim, CEO of Nextreme.
Dr. Deane graduated from the University of North Carolina at Chapel Hill in 1984 with a PhD in physics. He began his career at AT&T Bell Labs as an engineer working in advanced electronic component packaging. After Bell Labs, he served as the Director of the Advanced Packaging Group at MCNC, a micro-technology think tank located in Research Triangle Park in North Carolina. Dr. Deane then became a principal in Optical Process Technologies, which was acquired by JDS Uniphase in 2000. He has published more than 30 technical papers and holds numerous patents in the electronic packaging field. Dr. Deane is also a member of IEEE and IMAPS.
“I am very excited about joining Nextreme,” said Dr. Deane. “Nextreme’s thin film thermoelectric technology represents a radically new way to achieve in-package cooling. At Nextreme, I look forward to working closely with customers to develop a new packaging approach to address ever increasing thermal problems that are limiting progress in electronic and optical designs.”
The demand for smaller, faster, electronic devices with increased capabilities drives today’s technical markets. Improvements in semiconductor processing technology have contributed to this trend, however, heat management issues, such as the need for new packaging strategies, continue to demand attention. Nextreme has developed a thin film thermoelectric cooler, which is no larger than a piece of confetti, cools electronic and optoelectronic devices at the source.
About Nextreme Thermal Solutions
Nextreme Thermal Solutions manufactures advanced thin film thermoelectric components for the semiconductor, photonics, test-and-measurement, and defense/aerospace industries. These high-performance solid-state components operate as miniature heat pumps for cooling semiconductors and other electronics. They are also used for thermal management of fiber-optic laser controls and integrated optoelectronics. Nextreme's thin-film technology embeds an active cooling device in close proximity to the die of an integrated circuit. Other applications include converting heat into electricity for advanced power generation applications, thermal batteries, and automotive energy management.
COMP: Nextreme Thermal Solutions
3040 Cornwallis Road
P.O. Box 13981
Research Triangle Park, NC 27709-3981
Tel: (919) 990-8300
E-mail: info@nextremethermal.com
WWW: www.nextremethermal.com
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