SYRON® 7000 and 7100 circuit materials deliver high-temperature stability. These thermoplastic circuit laminates have a higher melt temperature than PTFE circuit materials, with an estimated Underwriters’ Laboratory (UL) relative thermal index (RTI) of greater than 210° C (410° F). They are also inherently flame retardant. Environmentally friendly SYRON materials are halogen-free and compatible with lead-free solder processes. They differ somewhat in their electrical characteristics, although both are available with ½-oz. very-low-profile electrodeposited copper foil cladding and in several standard panel sizes, including 12 x 18 in. (305 x 457 mm) and 24 x 18 in. (610 x 457 mm).
Rogers Corporation
www.rogerscorp.com
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