TE Connectivity (TE) announces new surface-mount LGA 2011 socket for Intel Corporation’s Core i7 and Xeon 5 CPU processors.
The contacts of TE’s new LGA 2011 socket include solder balls for surface mounting onto a printed circuit board (PCB). The product’s hex-ball array provides stronger housing and minimizes the space that the 2011 balls occupy. The socket boasts an integrated lever mechanism (ILM) that generates the Z-axis compression load and its robust bolster plate limits PCB bowing during compression.
The product is available in either 15u’’ or 30u’’ gold contact plating for enhanced product performance. TE provides a complete socket and hardware system, while the ILM and backer plate must be ordered separately.
TE Connectivity
http://www.te.com/
::Design World::