TE Connectivity will exhibit its data communication products and present four demonstrations highlighting its high-speed copper and fiber optic capabilities at DesignCon 2012, booth #411, January 31 - February 1, Santa Clara, California, USA.
In addition, TE Principal Engineer, Chad Morgan, will co-present a technical session examining the performance of constructing premium channels of 25 Gbaud NRZ signaling, or reusing 10 Gbps channels employing 12.5 Gbaud PAM-4 signaling, to increase the throughput of high-density backplane links to 25 Gbps.
TE’s four demonstrations will include the following products:
• STRADA Whisper connector: TE will demonstrate its STRADA Whisper connector’s capability to run 25 Gbps at distances longer than 1 meter in board-to-board and multiple channels.
• 24-Gbps connector proposed for SAS and PCIe standards: TE will demonstrate its new 24-Gbps connector, designed to improve data rates over existing SAS and PCIe protocols. The connector, if designed-in today for 6 Gbps and 12 Gbps data rates, will provide an upgrade path for future 24Gbps HDD and SSD applications.
• 25-Gbps zQSFP connector: On the brink of its launch, this I/O, full-duplex connector will be demonstrated showing copper links running at speeds of 25-28 Gbps and highlighting its backwards-compatible feature to standard QSFP connectors for easy system upgrades.
• 10-Gbps mid-board optical transceiver: TE will exhibit its capabilities in fiber optics through a demonstration of its 10-Gbps mid-board optical transceiver link via a multimode laminated fiber shuffle.
Products on display will include TE’s new KOAXXA RF connector product family in addition to the following latest interconnects: STRADA Mesa mezzanine connector, FORGE power connector, CXP pluggable connector/cage assembly, FULLAXS sealed connector system and ESD circuit protection products for USB 3.0 devices.
For more information on the TE booth #411 at DesignCon 2012, visit our special events web page.
TE Connectivity
www.te.com
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