Demonstration boards for semiconductor products

The LTC1668, 50Msps, 16-bit digital-to-analog converter (DAC) is for applications with analog frequency content between the audio range and several megahertz. DC2459A is a complete redesign of the original demonstration circuit. Several signal conditioning options are available for the analog output, and digital signals through one of several FPGA development boards. Example FPGA code is

Laird’s Liquid Cooling Systems and Temperature Controllers Designed for Semiconductor Fabrication Equipment

Laird (LRD: London) has developed custom cooling and temperature control systems for semiconductor fabrication equipment. The critical production tools used in semiconductor fabrication facilities must be reliable and easy to service to minimize downtime. Laird’s custom liquid cooling systems for semiconductor tools – which can include heat exchangers, pumps, sensors, thermoelectric modules, thermoelectric assemblies, thermoelectric

Ring drive handles high torque and speed

The Compact Ring Drive (CRD) system, with precision grade bearing and drive mechanism in a sealed housing, is easily programmed. The three-drive design allows the CRD to handle high speed, high torque or both, depending on the application. With a 250 or 350 mm dial plate bolt circle diameter and a large open center, users

High-Speed Fuses reduce peak let-through current and let-through energy

Littelfuse, Inc. has announced a new line of high-speed fuses for protection of power semiconductor devices used in industrial equipment. The POWR-SPEED line of fuses uses a special…

Power Electronic Tips

Power Magnetics Catalog Includes Reference Designs

Premier Magnetics, global producer of high-quality magnetic components for switch-mode power supplies, DC-DC converters and data communications applications, announces the availability of its new 87-page catalog providing details…

Power Electronic Tips

Power Magnetics Catalog Includes Reference Designs

Premier Magnetics, global producer of high-quality magnetic components for switch-mode power supplies, DC-DC converters and data communications applications, announces the availability of its new 87-page catalog providing details…

Power Electronic Tips

Schottky barrier rectifiers block 1.2 kV with low leakage

Littelfuse, Inc. has added two series to its expanding power semiconductor portfolio: the MBR Series Schottky Barrier Rectifiers (Standard Schottky) are the latest devices based on silicon Schottky…

Power Electronic Tips

Reliably attach printed circuit boards

These ReelFast surface mount fasteners have a variety of attachment options for printed circuit board applications. Depending on type, the fasteners can be specified to mount, stack, or space boards; attach components to boards; create right-angle attachment points on boards; or enable repeated access without requiring loose screws. All types are supplied on tape and

ESD and mechanical protection for test and burn-in from R.H. Murphy Co.

ISOPAK Test and Burn-In Carriers for semiconductor devices are unique because they provide complete ESD protection and also eliminate false test failures caused by conductive carriers. The device leads are electrically isolated so there is no chance of carrier conductivity being mistaken as leakage during testing. R.H. Murphy Company offers custom carriers to mate with

550-LV-RT — UL approved silicone for potting

Silcast 550-LV-RT is a thermally conductive silicone compound from epoxySet — a low viscosity system is ideal for potting, encapsulating and casting applications where performance at continuous operating temperatures up to 205° C are required. It is also suitable for temperature cycling down to -55° C. This unique formulation is UL-94VO certified and offers electrical insulation as

Half-Bridge eval board simplifies GaN transistor testing

GaN Systems has announced its new Half-Bridge Evaluation Board which demonstrates the performance of its GaN enhancement mode power semiconductors in real power circuits. The fully functional GS66508T-EVBHB…

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ETEL Launches a New Research Center

ETEL S.A., an international producer of direct drive-based motion technology, announces the opening of a new research and development division earlier this year. Owned by DR. JOHANNES HEIDENHAIN GmbH and based in Switzerland, ETEL plans to extend its position as a leader in the semiconductor industry worldwide. “We are researching positioning systems with nanometer precision,

AutomationDirect offers additional safety relays

AutomationDirect has expanded their offering of safety products to include additional Dold safety relay modules designed to be positively driven and assure a reliable opening and closing for safety applications. Relays are controlled by a built-in monitoring function, making them ideal for applications with e-stops, safety gates and light curtains. The Dold safety relay mat

High-speed data transmission in lightweight construction from Gore

W. L. Gore & Associates (Gore) introduces GORE® Aerospace Fiber Optic Cables to meet the civil aerospace industry’s need for reliable high-speed data transmission cables in a durable, lightweight construction. Engineered with a unique dual-buffering system, GORE® Aerospace Fiber Optic Cables withstand the challenging environments they encounter throughout an aircraft’s service life. These cables deliver

Cellular device kits for M2M designs from Symmetry Electronics

Symmetry Electronics has made starting a Cellular M2M Design very easy with custom Cellular IN-A-BOX kits based on Telit M2M modules. The various cellular technologies supported include: LTE, 3G, HSPA+, GSM, CDMA, 1xRTT, EVDO, and GPS tracking capabilities. The Telit Cellular M2M development kits are designed to start the evaluation of a cellular module and

Custom JEDEC matrix trays without tooling or waiting

Custom-manufactured JEDEC matrix trays safely and securely contain ICs, modules, sensors, MEMS, switches, and connectors, and electronic components. Rapidtray component trays from R.H. Murphy are for ESD and mechanical protection in an industry-standard format. The manufacturer uses precision injection molding and CNC machining to make the custom trays without custom tooling — suitable for engineering

LEDs with high efficacy and diminished “green gap”

The “Hi-Q-LED” project funded by Germany’s Federal Ministry of Education and Research (BMBF) has made pioneering advances with green LEDs, diminishing what is known as the “green gap” phenomenon—the significant drop in efficacy in the green spectral range. Conventional LEDs show a significant efficacy drop at wavelengths above 500 nm. Research activities in the framework

The Internet of Things and opportunity

The “Internet of Things” tends to start a lot of silly conversations based on misconceptions about the topic. For starters, what “thing” are we talking about? If it’s a connected car, there might be a lot to talk about. If it’s a light bulb or a toaster, maybe not so much. Can we take a

Semtech brings LoRa™ RF technology to Wi-SUN development platform for meter reading and industrial applications

Semtech Corp., a leading supplier of analog and mixed-signal semiconductors, today announced it has joined with other members of the Wi-SUN Alliance™ to produce a radio frequency (RF) development platform targeting advanced metering infrastructure (AMI) and industrial applications. The development platform includes Semtech’s SX1276 Wi-SUN compliant RF transceiver that features its long-range LoRa™ technology, combined

Progress on a thermally and electrically conductive die-attach film

AI Technology, Inc. (AIT) claims to have solved one of the technically more challenging problems in wafer level semiconductor packaging to achieve conductive die-attach film adhesive (DAF) of 20-micron thickness. While DAF adhesive at the wafer level is becoming more prevalent in die-attach for memory modules in precision bonding and thin packages, thermally conductive and

Absolute Optical Encoders Achieve ±0.5 µm Accuracy

In some semiconductor applications, component “multitasking” can lead to axes collisions. Amicra Microtechnologies, a developer and manufacturer of precision assembly systems that bond and mount active/passive semiconductors, lenses, MEMS and processors for microelectronics and micro-optics applications in the automotive, telecommunications and information technology industries found a way to prevent such collisions. Its NovaPlus series machines

EtherCAT: new device standard for semiconductor industry

The EtherCAT Technology Group (ETG) released ETG.5003-1 device standard for the semiconductor industry. This standard has nine corresponding specific device profiles to aid engineers in the design of tools in the semiconductor industry. With these device profiles, EtherCAT can be used for more than just motion control, I/O, sensors, and gateways in semiconductor manufacturing machines.

Protect Electronics with Silicones

by Rohit Ramnath, Master Bond Inc. Silicone compounds are used in thousands of electronic systems to seal, bond, coat, and encapsulate components, enabling them to perform reliably under challenging conditions. Formulators continue to improve silicones to make them easier to use and to offer a wider variety of properties. Since the 1980’s, the electronics industry

Introducing SENTINEL Molded Foam Silicone Rubber Heaters

Durex Industries recently announced the product introduction of the SENTINEL Molded Foam Silicone Rubber Heater.   In semiconductor equipment applications Durex Industries’ SENTINEL heaters offer the advances of improved thermal efficiency, higher process temperatures, and reduced system cost. Durex Industries developed this advanced heater technology, because Semiconductor Equipment Industry engineers need thermal solutions that meet specifications

Fairchild Semiconductor’s New Motion SPM 5 Series

Designers of motor control systems need solutions that optimize efficiency and ensure maximum reliability under harsh application conditions. To meet this challenge, Fairchild Semiconductor developed the SPM 5 smart power module series 3-phase MOSFET inverter solution, providing designers an AC induction motor (ACIM) and Brushless DC (BLDC) motor inverter solution for motors up to 200W including