Micro-Mold®
Micro-sized parts are produced in our own micro-molding machines, utilizing processes that we developed our business with over 20 years ago. Our Micro-Molded parts range from about 1/2 inch in size to parts measured in microns. These components often have complex geometry and very tight tolerances.
Accumold builds specialized molding machines for this unique capability. The machines are engineered to handle volumes from prototypes to 5,000,000 or more parts per year while maintaining consistent, precise tolerances that are unique in the industry. The specialized tooling and molding for micro-sized components are only available at Accumold.
Small Parts
The largest part that we mold is approximately three inches in diameter, close to 1 ounce in part weight. Micro-sized features and ultra precision tolerances are consistently realized. Using Accumold’s proprietary modifications, with standard Boy and Sumitomo presses, parts are made with minimal waste and fast cycle times.
Lead Frame / Insert Molding
Accumold’s tooling and automation systems for lead frame molded parts and insert applications are second to none. Components can be singulated and shipped bulk, or tape-and-reel to our customers. The MEMS and IC packaging industries benefit from this specialized capability.
Manufacturing lead frame molded parts requires fabrication of a system to feed the metal lead frame into the machine and to extract the complete component from the metal after the plastic has been molded to it. Our systems designers are experts in fabricating a trouble free and efficient system to mold the most sophisticated lead frame molded parts.
Facilities:
Accumold is an ISO 9001:2008 and ISO 14001:2004 certified company with a state-of-the-art, 82,000 square foot production plant. The Accumold facilities are located near Des Moines, IA, in the heart of the Midwest. The building is climate controlled and includes four 100K clean rooms and two 10K clean rooms for electronic and medical applications. Our facility not only includes space for MEMS packaging and lead frame assembly and, if needed, space for sub system assembly as well.