Low thermal expansion epoxy from epoxySet

epoxySet announces the release of the EB-315, low thermal expansion epoxy, to the line of low expansion/ thermally conductive products. This versatile material can be used as an adhesive or encapsulant for semi-conductors and other microelectronics, a gasket sealing compound, wire bonder or any application where temperature cycling between -55°C and 230°C is required. The coefficient of thermal expansion is under 25ppm/°C with a glass transition temperature of 182°C making it an excellent choice for low stress applications bonding fragile parts. EB-315 is resistant to most chemicals so can be used in a wide range of environmental conditions. Modified versions can be offered to meet the most demanding applications.

component-bonding

epoxySet
www.epoxyset.com

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