Texas Instruments introduces new microcontroller dev kit

347fb44Newark element14 today announces the launch of  Texas Instruments’ MSP CapTIvate microcontroller (MCU) development kit, a comprehensive, easy-to-use platform providing real-time sensor tuning, all without writing a single line of code. The modular design, easy-to-access data and application orientated approach of the MSP430FR2633-based MCU board, contained within the kit, makes it ideal for application in, for example, thermostats, white goods and personal electronics.

The kit contains a CAPTIVATE-FR2633 target MCU module, CAPTIVATE-PGMR eZ-FET with EnergyTrace technology and HID communication bridge, CAPTIVATE-ISO UART, I2C and SBW isolation board, CAPTIVATE-BSWP self-capacitance demo (Out-of-Box Experience), CAPTIVATE-PHONE mutual capacitance demo with haptics and guard channel and CAPTIVATE-PROXIMITYproximity detection and gesturing demo.

The MSP430FR2633-based MCU board, a programmer/debugger board with EnergyTrace technology, measures energy consumption with the TI’s Code Composer Studio integrated development environment (IDE), and sensor boards to evaluate self-capacitance, mutual capacitance, gesture and proximity sensing.  Users can evaluate the MSP430FR2633 microcontroller with CapTIvate touch technology, which provides the highest resolution capacitive-touch solution in the market.  MSP MCUs with CapTIvate technology are the industry’s lowest power capacitive touch MCUs with 10 V rms noise immunity and support for dirt-proof, glove-friendly designs.

Features and benefits of the development kit are:

Modular Design

  • Different sensing panels can be attached through a common connector.
  • The programming/debug logic has been split from the target MCU, unlike a typical LaunchPad which has both components on one PCB. This allows for an isolation module to be inserted between the two for testing/tuning, or for the programming/debug module to be used for in-system product development.
  • The target MCU PCB features BoosterPack plug-in board headers, allowing it to be used as a BoosterPack for another LaunchPad development kit, such as the MSP-EXP432P401R LaunchPad kit.

Application Oriented

  • The sensing panels included in the kit are designed to mimic real applications.
  • Evaluating a new application simply involves laying out a basic 1 or 2 layer PCB with a footprint for the sensor connector, or simply laying out electrodes with copper tape and wiring them into the connector.

Easy Access to Data

  • EnergyTrace technology power profiling enables capturing of power profiles without any measurement equipment.
  • The HID-Bridge communications interface allows easy debug data transfer between the target and a PC over UART or I2C.

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