XMC-8320 Dual Multicore DSP Processing Module from Spectrum

Spectrum Signal Processing by Vecima, trusted supplier of embedded processing, RF and I/O solutions, today announced the XMC-8320 digital signal processing (DSP) engine that features two TMS320C6670 radio system-on-chip (SoC) multicore devices from Texas Instruments (TI). This module provides powerful processing for a broad range of defence and commercial applications, such as satellite communications (SATCOM), telecommunications infrastructure, including LTE, WCDMA, TD-SCDMA and WiMAX, industrial control, radar, signals intelligence (SIGINT), software defined radio (SDR), and cognitive radio (CR).

XMC-8320-module

XMC-8320 module with C6670 multicore devices.

“The XMC-8320 module offers eight DSP cores, and economically replaces clusters of previous-generation DSPs to ultimately reduce the size, weight, and power of a system,” said Mark Briggs, General Manager at Spectrum. “This module integrates the full baseband processing chain on one card with additional capacity to implement the customers’ application.”

“The C6670 is 100 percent backwards compatible with software for C62x, C64x+ and C67x devices, enabling customers to reuse their valuable existing software while upgrading their hardware and extending the life of their products,” said Arnon Friedmann, marketing manager, DSP, TI. “The C6670 SoC, based on TI’s KeyStone multicore architecture, integrates four C66x DSP cores in each device to offer real-time performance that helps customers realize R&D savings while getting to market faster.”

The C6670 device is capable of either fixed-point or floating-point calculations and offers wireless accelerators such as Turbo, Viterbi, FFT and Rake to enable developers to develop multistandard communications-centric solutions for the industry. The 6670 device also provides a path for parallel processing for Fast-Fourier transform (FFT) which is required in computing intense applications such as radar.

The XMC-8320 module provides front panel connectors for antenna interface (AIF) to enable connection to remote radio heads using OBSAI or CPRI protocols, and two front-panel GigE ports. The board uses a PCIe x8 Gen 2 host interface, and provides high-speed serial input/output connections such as Serial RapidIO (SRIO), SGMII, and additional AIF.

The XMC-8320 module features include:

  • Two quad-core TMS320C6670 DSPs
  • Fixed- and floating-point up to 26.6 GMacs per core @ 1 GHz / 16 GFlops per core @ 1 GHz
  • 2 GB of DDR3 SDRAM onboard
  • High-speed 50 Gbps TI hyperlink interprocessor communications (chip-to-chip connectivity between DSPs)
  • XMC module supporting PCI Express x8 Gen 2 (VITA 42.3) (4 GB/s full-duplex)
  • Front panel connectors: AIF (2 ports, 4 lanes each) to enable connection to remote radio heads, and GigE (2 ports)
  • Secondary XMC connector: high-speed serial I/O SRIO x6, AIF x2, SGMII x2, and GPIO x30, RS-232 x2, and SPI
  • The XMC-8320 module is available in XMC, 3U VPX, PC/server and AMC form factors.

Spectrum Signal Processing
www.spectrumsignal.com

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