ADLINK Technology, a leading global provider of cloud-based services, intelligent gateways, and embedded building blocks for edge devices that enable the Internet of Things (IoT), has selected Sealevel Systems, Inc. as a 2015 Channel Partner of the Year. The announcement came at ADLINK’s recent National Sales Meeting for its Americas region held in Newport Beach, CA where attendees heard case studies of several successful collaborations between the two companies to provide industry-leading computing and I/O solutions for OEMs across vertical markets including military, automotive, and facility management.
ADLINK’s computer-on-module (COM) products combine with Sealevel’s custom carrier board designs that take advantage of the company’s wealth of I/O technology. ADLINK’s COM products provide the generic computing engine along with storage, Ethernet, keyboard/mouse, and display common to most applications. The modular architecture allows future upgrade of the processor subsystem and offers superior system life cycle management. ADLINK’s modules are available based on COM Express, Qseven and SMARC specifications.
Sealevel’s carrier boards provide the application-specific circuitry optimized for each customer’s unique application. Common I/O carrier board features include serial, digital and analog I/O, all of which can be designed to meet the I/O count, voltage ranges, and connector types required by the application.
“Working closely with ADLINK, we’ve been able to solve diverse customer requirements while meeting challenging time and cost constraint,” said Ben O’Hanlan, president of Sealevel. “We are honored to receive the Channel Partner of the Year award from ADLINK and look forward to building on our successes.”
“ADLINK depends on the success of our channel partners to help us continue our strong year-over-year growth and continue meeting the needs of our varied customers,” said Elizabeth Campbell, general manager of ADLINK Technology Americas. “Sealevel has shown deep knowledge of ADLINK’s product capabilities and used it to develop reliable system-level solutions, and we look forward to continuing our work together in 2016.”