Design World

  • Home
  • Technologies
    • 3D CAD
    • Electronics • electrical
    • Fastening & Joining
    • Factory automation
    • Linear Motion
    • Motion Control
    • Test & Measurement
    • Sensors
    • Fluid power
  • Learn
    • Ebooks / Tech Tips
    • Engineering Week
    • Future of Design Engineering
    • MC² Motion Control Classrooms
    • Podcasts
    • Videos
    • Webinars
  • LEAP AWARDS
  • Leadership
    • 2022 Voting
    • 2021 Winners
  • Design Guide Library
  • Resources
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Women in Engineering
  • Supplier Listings

AI Technology, Inc. Releases Second Generation COOL-PAD™ CPR 7154

By Frank Tobe | April 9, 2014

Share

AI-TechnologyAI Technology, Inc. (AIT) introduces COOL-PAD™ CPR7154, a new class of thermal interface material that dispenses like a thermal pad, but performs with characteristics like that of a grease or gel when device temperatures increase to above 45°C. COOL-PAD™ CPR7154 is optimized to accommodate large areas with different heights and gaps of less than 3-mil along its interfacing area. It is filled with a modified oxide mixture and is electrically insulating at normal voltage. It is designed to have high compressibility as applied in comparison to traditional thermal pads. Once the device temperature reaches 45°C, COOL-PAD™ CPR7154 will “melt-flow” to fill even the smallest of trapped air along the interface between the device and heat-sink or heat-spreader.

COOL-PAD™ CPR7154 is semi-tacky on both sides for optimum thermal transfer performance. COOL-PAD™ CPR7154 has high thermal conductivity and low Tg characteristics that impose minimum thermal stress on bonded parts during thermal cycling or shock testing. While COOL-PAD™ has some intrinsic tack strength, it is not designed for bonding. A mechanical fastener must be used to provide assembly integrity.

A mechanical fastener of 5 psi or more is recommended to provide intimate contact between the COOL-PAD™ and the interfacing surface. Because COOL-PAD™ is compressible, it will fill in uneven height differentials and warps between the mating surfaces. The ultimate performance of COOL-PAD™ is achieved after the first cycle of melt-flow phase-change at 45°C or automatically when the device heats up during operation or with externally applied heat if the device is not anticipated to reach 45°C .

COOL-PAD™ CPR7154 is designed for thermal interface applications to withstand the worst of temperature and moisture exposure in outdoor LED luminaire applications with modules from Philips, Cree, Bridgelux, etc. Of course, the same phase-change pad works great for CPU and GPU in Xbox360, Play Station, and other game consoles. COOL-PAD™ CPR7154 is also ideal for CPU modules and graphic card interfaces in laptops and desktops such as Asus, Samsung, BenQ, Foxconn and other OEM.

AI Technology, Inc.
www.aitechnology.com


Filed Under: TECHNOLOGIES + PRODUCTS, ALL INDUSTRIES, Adhesives • epoxies, Packaging, Materials • advanced
Tagged With: aitechnology
 

Tell Us What You Think!

Related Articles Read More >

50 years of bit parallel encoders from POSITAL
EXAIR 3D model and CAD Library has more than 70 extensions
New igus E4.1R rol e-chain reduces noise, vibration and saves electricity
55417-edgeConnectoren_V3.0_05-2022_cmyk_300dpi
edgeConnector product family from Softing now include a REST API

DESIGN GUIDE LIBRARY

“motion

Enews Sign Up

Motion Control Classroom

Design World Digital Edition

cover

Browse the most current issue of Design World and back issues in an easy to use high quality format. Clip, share and download with the leading design engineering magazine today.

EDABoard the Forum for Electronics

Top global problem solving EE forum covering Microcontrollers, DSP, Networking, Analog and Digital Design, RF, Power Electronics, PCB Routing and much more

EDABoard: Forum for electronics

Sponsored Content

  • Global supply needs drive increased manufacturing footprint development
  • How to Increase Rotational Capacity for a Retaining Ring
  • Cordis high resolution electronic proportional pressure controls
  • WAGO’s custom designed interface wiring system making industrial applications easier
  • 10 Reasons to Specify Valve Manifolds
  • Case study: How a 3D-printed tool saved thousands of hours and dollars

Design World Podcasts

May 17, 2022
Another view on additive and the aerospace industry
See More >
Engineering Exchange

The Engineering Exchange is a global educational networking community for engineers.

Connect, share, and learn today »

Design World
  • Advertising
  • About us
  • Contact
  • Manage your Design World Subscription
  • Subscribe
  • Design World Digital Network
  • Engineering White Papers
  • LEAP AWARDS

Copyright © 2022 WTWH Media LLC. All Rights Reserved. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media
Privacy Policy | Advertising | About Us

Search Design World

  • Home
  • Technologies
    • 3D CAD
    • Electronics • electrical
    • Fastening & Joining
    • Factory automation
    • Linear Motion
    • Motion Control
    • Test & Measurement
    • Sensors
    • Fluid power
  • Learn
    • Ebooks / Tech Tips
    • Engineering Week
    • Future of Design Engineering
    • MC² Motion Control Classrooms
    • Podcasts
    • Videos
    • Webinars
  • LEAP AWARDS
  • Leadership
    • 2022 Voting
    • 2021 Winners
  • Design Guide Library
  • Resources
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Women in Engineering
  • Supplier Listings