SANTA CLARA, Calif.–Applied Materials, Inc.(NASDAQ:AMAT) launched its Applied Inflexion™ edge polishing system, a unique, high-precision defect removal system that polishes and cleans the critical wafer edge region. The Applied Inflexion is the only system that polishes the entire wafer edge, removing film stack residues and shallow surface defects in a single pass while minimizing the exclusion area in order to maximize the number of good die. In addition, the system precisely controls the edge profile, enabling customers to tailor the film-to-wafer interface to meet a wide range of integration requirements.
The Applied Inflexion system’s high productivity platform can be configured with up to three processing modules to deliver twice the throughput of competing edge polishing systems. The system integrates Applied’s production-proven Desica® single wafer wet cleaner to assure excellent defect performance on all surfaces. Using abrasive tape with proprietary head technology, the Inflexion system delivers a non-selective process that efficiently removes all materials, including metal/dielectric stack residues not easily removed by other cleaning methods, from the entire edge region that comprises the notch, bevel, apex, and front and back exclusion zones. For more information, please visit www.appliedmaterials.com/products/edge_polishing_4.html.
When the Applied Inflexion system is used in conjunction with the Applied SEMVision™ G4 defect review tool, these systems provide a comprehensive wafer edge defect removal, review and analysis solution, enabling customers to successfully characterize and control edge defect issues, especially in immersion lithography.
Filed Under: Semiconductor, Materials • advanced