Applied Materials, Inc. today announced its innovative Applied DuraPad&trade CMP polishing pad technology for 200mm chemical mechanical planarization (CMP) systems. The DuraPad has >30% longer pad life than existing pads for increased CMP system productivity and delivers compelling cost of ownership savings to customers. Robust manufacturing methodology enables exceptional pad-to-pad reproducibility with less than 2% variation across key parameters – for predictable CMP process results.
“Pad consumables is a new market for Applied Materials and is the result of our collaboration with Praxair Electronics(1),” said Manfred Kerschbaum, senior vice president and general manager of Applied Global Services. “The most critical consumable for a CMP system is the polishing pad and we’re excited to bring new pad technology to customers that has significantly improved lifetime, performance and cost of ownership. In addition, the DuraPad polishing pad is a replacement that requires minimal tuning for specific process conditions.”
Key to the DuraPad’s high reproducibility is continuous sheet cross-linking and curing, which enables remarkable within-pad and pad-to-pad consistency. The DuraPad also incorporates Praxair’s patented inert-gas foaming process that optimizes the pad pore structure for reduced defects and lower slurry flow requirements.
The Applied DuraPad polishing pad’s unique design is a result of Applied’s vast experience in CMP, with more than 2,000 CMP system installations at customer sites worldwide. The DuraPad has already been qualified by major customers on advanced CMP applications. For more information about Applied DuraPad CMP polishing pads, please visit http://www.appliedmaterials.com/products/spares_products.html.
Applied Materials, Inc.
Filed Under: Semiconductor