SANTA CLARA, Calif.– On June 2nd
Applied Materials, Inc. (NASDAQ: AMAT) will host an evening of presentations and
discussion exploring the strategies needed to scale device performance,
functionality and cost for the next decade. A panel of industry
executives will share their perspectives on advancements in lithography
and patterning materials, new design layouts, 3D integration and novel
packaging schemes that are expected to drive greater device densities
and process efficiencies.
Titled “New Dimensions to Moore’s
Law,” this important event will take place in
conjunction with the prestigious International Interconnect Technology
Conference (IITC) in Burlingame, CA.
Panel: |
Dan Hutcheson, VLSI Research |
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Chris Malachowsky, nVidia Corporation |
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Klaus Schuegraf, SanDisk Corporation |
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Scott Becker, Tela Innovations |
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Tom St. Dennis, Applied Materials |
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Where: |
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The Hyatt Regency at San Francisco Airport, |
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1333 Bayshore Highway, Burlingame, CA 94010 |
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When: |
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Monday, June 2nd, 2008 |
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Schedule: |
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5:00pm |
Registration and Reception |
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6:15pm |
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Panel and Q&A |
For event registration, please visit www.appliedmaterials.com/2008_IITC/
::Design World::
Filed Under: Semiconductor manufacture, ELECTRONICS • ELECTRICAL
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