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April 10 is deadline to apply for Emerson’s 2018 ASCO Engineering Scholarship

By Paul Heney | April 2, 2018

emerson industrial logoU.S. students pursuing a degree in engineering are urged to apply by the April 10, 2018, deadline for Emerson’s 2018 ASCO Engineering Scholarship program.

Emerson will award two $5,000 scholarships to U.S. engineering students, provide $1,000 grants to their college’s engineering departments, and host the two student recipients at “The Amazing Packaging Race” at PACK EXPO International 2018.

Applications are now being accepted at www.asco.com/scholarship. Students seeking to submit a scholarship application must be enrolled full-time in an undergraduate or graduate program in an instrumentation, systems, electrical, mechanical, or automation engineering discipline at an accredited U.S. educational institution for the 2018/2019 academic year. Candidates must also maintain at least a 3.2 cumulative GPA on a 4.0 scale and be a U.S. citizen or legal U.S. resident. The ASCO engineering scholarship is merit-based and will be awarded on the candidate’s experience and potential for leadership, particularly as it relates to the application of fluid control and fluid power technologies. A panel of Emerson executives and independent judges will select the finalists. The deadline to apply is April 10, 2018.

The scholarship will be presented at “The Amazing Packaging Race” at PACK EXPO International, to take place in Chicago from October 14-17, 2018. The race, sponsored by Emerson, is a fun and educational event that pits teams of packaging students, from programs around the country, against each other in a race to gather points by completing tasks at specific PACK EXPO booths.

While STEM—science, technology, engineering, and mathematics—occupations in the U.S. are growing at twice the rate of others, student achievement in STEM in the U.S. continues to lag behind many other countries. Emerson is dedicated to making a difference by supporting student education in STEM studies through such innovative programs as the ASCO Engineering Scholarship. Since the first award ten years ago, $100,000 in scholarships have been granted to 20 U.S. students based on their potential for leadership and for making a significant contribution to the engineering profession. Another $20,000 in grants have been awarded to the engineering departments of the colleges where the recipients are enrolled.

Emerson
emerson.com

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Filed Under: NEWS • PROFILES • EDITORIALS, Packaging

 

About The Author

Paul Heney

Paul J. Heney, the VP, Editorial Director for Design World magazine, has a BS in Engineering Science & Mechanics and minors in Technical Communications and Biomedical Engineering from Georgia Tech. He has written about fluid power, aerospace, robotics, medical, green engineering, and general manufacturing topics for more than 25 years. He has won numerous regional and national awards for his writing from the American Society of Business Publication Editors.

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