Scientists have developed a new adhesive structure that improves adhesion, even to rough surface. Adhesion is involved whenever industrial components are moved without leaving any residues behind. But the surfaces of these objects are never completely smooth. Even those surfaces that appear smooth to the human eye tend to be rough when observed under a…
Hybrid Inks Permit Printed, Flexible Electronics Without Sintering
Research scientists at INM have combined the benefits of organic and inorganic electronic materials in a new type of hybrid inks. This allows electronic circuits to be applied to paper directly from a pen, for example. The electronics of the future will be printed. Flexible circuits can be produced inexpensively on foil or paper using…
Robotic Gripping Surface for Sensitive Devices Adds New Dimension to Handling
During production, these parts have to be handled repeatedly by pick-and-place processes. The proprietary Gecomer principle reduces the risk of surface contamination with residues, and of mechanical damage due to gripping. In their latest version, researchers at the Leibniz Institute for New Materials (INM) have improved the adhesive force in their Gecomer structures up to…