MINNEAPOLIS, MN — In order to help provide North American packaging machine builders and manufacturers a globally competitive edge, Beckhoff Automation will be exhibiting at Pack Expo 2008 in full force.
Beckhoff will put forward a dynamic packaging presence in booth # E-6425, Lakeside Center (East Building) in Chicago’s McCormick Place, Nov. 9 – 13. The numerous highlights will include a series of “filling,” “forming” and “sealing” packaging demos tied together via Ethernet. These will feature Beckhoff’s high performance AX5000 series servo drives, which are EtherCAT-enabled. Ideal for packaging applications, EtherCAT® is the top performance, high speed Industrial Ethernet technology for I/O, automation, motion control and connectivity.
In addition, an EtherCAT “Hot Connect” I/O demo will show flexible Ethernet “hot swap” functionality with powered devices without loss of the EtherCAT signal; a new CX series PAC demo will show the versatility and scalability of Beckhoff’s Embedded PC line including the new 1.8 GHz CX1030 and the cost effective, 500 MHz CX1010; Highlighting “ease of connectivity,” Beckhoff will also show a new OPC-UA demo for yet another flexible option for open machine networking.
Another Pack Expo debut is the new Beckhoff C65xx series Industrial PC for flexible electrical cabinet installation. With its innovative external heat sink, this new PC reduces panel space while allowing higher cabinet operating temperatures. Small PLCs from Beckhoff’s BC and BX lines will show their power with a bowl feeder demo that demonstrates how a small PLC can handle a high accuracy feedback loop with a minimal amount of hardware.
“Beckhoff is dedicated to helping our North American customers succeed in a competitive packaging market that is increasingly global in nature,” said Graham Harris, President, Beckhoff Automation. “By utilizing technologies that are as open, flexible and cost effective as they are powerful, machine builders and manufacturers can seize the moment during these turbulent economic times and engineer the health of their business well into the future. Those companies that take action and seek engineering efficiencies as aggressively as they do financial ones will be in a much better position in the years to come.”
Filed Under: Packaging, Drives (servo) + amplifiers, Industrial computers, PCs