Beckhoff Automation has announced another addition to the popular family of ultra-compact C60xx series Industrial PCs (IPCs) with the new C6025. This space-saving IPC is designed to deliver the high computing performance of the Intel Core i series in a fanless, small-form-factor device. The new Intel Core i U processors, with exceptionally low power requirements, have made this advancement possible.
Measuring just 82 x 127 x 40 mm and combining high computing performance with a fanless design, the Microsoft “Azure Certified” C6025 IPC is an ideal choice for demanding automation and IoT applications where green, sustainable IT is also a requirement. The Intel Core i U processors deliver Core i performance capabilities yet consume significantly less power than other processors of the same series. The 8th Gen Intel Core i U processors used in the C6025 also offer an advantage typical of evolving PC-based technology: higher performance at the same price point as previous offerings. With this new addition, the Beckhoff portfolio of industry-ready and long-term available IPCs now spans five CPU performance classes – from ARM through to Intel Xeon – for maximum hardware scalability.
The energy-efficient Intel Core i U processors in the IPC, in combination with an advanced cooling design, enable fully passive heat dissipation via a heat sink on one side. Housed in an aluminum and zinc die-cast enclosure, the C6025 feature set offers the following:
– up to four CPU cores
– 4 GB DDR4 RAM (expandable to 8 GB)
– 40 GB M.2 SSD with 3D flash memory
– 1 x DisplayPort video connector
– 4 x USB 3.0 ports
– on-board Ethernet controller with 3 x 100/1000Base-T ports
– operating temperature range of 0 to 50° C
The energy-efficient, ultra-compact C6025 IPC expands the broad PC-based control portfolio from Beckhoff to offer a performance level situated between the entry-level devices with Intel Atom CPUs and those with high-end Intel Core i-series processors. With this addition, the Beckhoff product portfolio better addresses the growing trend toward compact, fanless IPCs while supporting applications with highly intensive computing requirements.
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