The Beckhoff Automation booth (S-6302) will be the center of automation technology (AT) and IT convergence at Pack Expo 2017 in Las Vegas. The comprehensive Beckhoff system architecture for packaging machine automation promotes control hardware consolidation by advancing powerful PC-based control technology.
This approach takes the best from AT and IT, making the most powerful tools available to engineering teams in one universal environment. All the benefits from the early days of this effort remain from the integration of PLC, motion control and HMI, while adding other high value functions for robotics, safety, high-end measurement, condition monititoring, and of course, cloud connectivity and IoT.
North America’s premier packaging industry event, Pack Expo takes place September 25 – 27, 2017 at the Las Vegas Convention Center. Visitors to the Beckhoff booth will again be able to “BYOD”, using their own smartphones and tablets to connect with PC-based control demos – including a wall of IoT-enabled devices, plus articulated robot arms from Stäubli – using any mobile device with a web browser. Cloud connectivity will be a connecting thread throughout the Beckhoff booth and in machine builder booths, such as groninger USA (N-107).
Additional Smart Factory solutions will factor heavily throughout the Beckhoff booth, such as One Cable Automation via EtherCAT P, which integrates the previously separate power and signal lines into a single, standard 4-wire Ethernet cable. The latest motor and drive solutions with One Cable Technology (OCT) will also be shown in the form of demos and test stands for hands-on evaluation.
HMI software in the spotlight
Cloud connectivity in automation optimizes packaging operations
Beckhoff has machine builders and manufacturers covered whether they need to gather and store process data, integrate condition monitoring or implement track and trace functions in packaging machinery. With TwinCAT IoT and TwinCAT Analytics, packaging machines directly benefit from Industrie 4.0 and IoT applications. Engineering efficiency is greatly increased because the software packages share the same universal platform as all other packaging machine programming tools from Beckhoff, including PLC, motion control, safety, HMI, robotics/kinematics and much more.
High-end measurement technology: ultra-precise, fast and robust
The new ELM series EtherCAT I/O modules feature metal housings that optimize shielding and cooling in measurement technology applications. At the same time, the durable housings provide enhanced flexibility at the interface level, such as for LEMO or BNC plug connectors or for the well-established cage clamps, as a quickly customizable and standard solution. Measurement accuracy of 100 ppm at 23 °C, precise sub-1 μs synchronization, 24 bit resolution and a high sampling rate of up to 50,000 samples per second guarantee high-quality data acquisition.
Meet the smallest Industrial PC from Beckhoff
The new C6015 Industrial PC (IPC) opens up application areas for PC-based control technology, especially those with pronounced cost or space restraints. Fully suited to industrial applications, this IPC measures just 82 x 82 x 40 mm, demonstrating the extensive scalability of PC-based control technology from Beckhoff. The Microsoft Azure™ Certified C6015 is ideal for machine control and IIoT applications. Powerful Intel® Atom™ processors are available, including those with multi-core technology up to 4 Cores. Price savings of approximately 25 percent also place the device well below the previously least expensive x86 IPCs from Beckhoff. These features facilitate highly cost-effective implementation of automation, visualization and system-wide communication in small- and mid-size applications with a minimal device footprint. As a result, the space-saving device opens up areas of use where PC-based control technology has not been used thus far, or where motherboards must be integrated as expensive, custom solutions.
For more information: Beckhoff at Pack Expo
“Beckhoff Automation will demonstrate system-integrated solutions for automation, HMI, IoT and more at Pack Expo 2017.”
Filed Under: TECHNOLOGIES + PRODUCTS, Design World articles, Packaging, IoT • IIoT • internet of things • Industry 4.0, PCs