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Communication model handles rugged conditions

By Editor | January 23, 2013

In military applications, the environment a device must endure may not be well defined. But any component unable to handle an extreme or rugged environment risks failure. The bCOM6-P1100 Rugged Type 6 COM Express Module is a board designed for deployment in challenging or harsh commercial environments. It includes a Freescale™ PowerPC™ processor.

The on-board components were selected specifically for their reliability in demanding conditions, and, unlike systems designed for benign environments, processor and memory are soldered to the board for maximum resistance to shock and vibration. Extended mechanical construction protects the module, which is designed for optional conformal coating for even greater resistance to moisture, dust, chemicals, and temperature extremes.

bCOM6-P1100-hr_opt

The small form factor of the architecture takes up little space, while its separation of processor and carrier board allows simple, inexpensive upgrades. The module offers a range of two Freescale PowerPC QorIQ processor options, with performance between 800 MHz and 1.2 GHz (x2) and power consumption between 3.5 W and 13.0 W. Up to 8 GB of DDR3 SDRAM with ECC can be configured, allowing the most demanding applications to be deployed.

GE
www.ge.com


Filed Under: Ethernet — cables • hubs • switches, Computer boards
Tagged With: ge
 

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