AlSiC (Aluminum Silicon Carbide) is a metal matrix composite for use in the housing, interconnection, and thermal management of microelectronic, optoelectronic, and power
electronic devices.

Unlike traditional packaging materials, AlSiC enables a tailored coefficient of thermal expansion (CTE). This makes it compatible with various electronic devices and assemblies. By modifying the Al-metal/SiC-particulate ratio, the isotropic CTE value of AlSiC is adjustable for specific applications. AlSiC’s CTE matching capabilities eliminate thermal interface stacking, which increases reliability in the field.

Also, the composite’s high thermal conductivity increases thermal dissipation and prevents bowing and flexing of packaging and substrate material. Traditional packaging materials with lower thermal dissipation can cause delamination, which leads to air gaps and poor reliability.
The CPS AlSiC near and net-shape fabrication process produces the composite material and fabricates the product geometry. With the casting process, OEMs can integrate high thermal
conductivity inserts (>1000 W/mK) or cooling tubes for more advanced thermal management solutions.

CPS Technologies Corp.
www.alsic.com

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