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COMSOL announces event series focusing on acoustics simulation

By Paul Heney | April 20, 2022

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COMSOL, maker of the COMSOL Multiphysics simulation software, is continuing its global virtual event series with COMSOL Day: Acoustics, to be held in three different time zones, with each event featuring a one-day program focusing on acoustics simulation. Sessions will be hosted online on April 28, May 5, and May 19 by organizers in the USA, Europe, and China, respectively.

The events will bring together engineers and scientists looking to advance simulation-driven product development within acoustics and vibrations — two areas that are growing rapidly thanks to a surge in audio applications. The program will feature keynote speakers from research organizations and the audio and automotive industries. Presentations by COMSOL speakers will cover trends in acoustics simulation, such as how companies can benefit from creating their own simulation apps and using the Model Manager in COMSOL Multiphysics, along with application-specific demonstrations and interactive Q&A sessions.

The increasing demand for high-quality audio in everything from phones to concert halls is putting pressure on device manufacturers to develop and optimize acoustics performance for a great variety of products and applications. Virtually every product or device generating sound or vibrations depends on several coupled physics phenomena to operate: typically, electrical, mechanical, fluid flow, and acoustics phenomena. To accurately predict and optimize the real-world performance of such products with simulation, the underlying model needs to take into account coupled physics phenomena: that is, multiphysics.

COMSOL Day: Acoustics provides an opportunity to see how acoustics industry leaders are addressing development and optimization challenges by turning to multiphysics simulation.

Keynote talks:

  • April 28 (USA)
    • “Design and Optimization of Sonos Smart Speakers Using COMSOL Multiphysics®” by Brizi Brown and Wei Yang, Sonos
    • “Automotive Audio in the Digital Age” by Patrick Dennis, Nissan
  • May 5 (Denmark)
    • “Electroacoustic Metamaterials: Designing New Properties of Acoustic Interfaces Through Active Electroacoustic Resonators” by Hervé Lissek, École polytechnique fédérale de Lausanne (EPFL)
    • “Soundbar Designer: An App(lication) for Coupled Electroacoustics Modeling” by Roberto Magalotti, Bowers & Wilkins
  • May 19 (China)
    • “Car Audio System Design with Multiphysics Simulation” by James Gan, Harman Automotive Electronic System (Suzhou)
    • “Acoustic Optimization in Vehicles Using COMSOL Multiphysics®” by Zhiwen Chen, Tymphany

In addition, each event will include COMSOL presentations on topics such as:

  • News and Trends in Acoustics Simulations
  • Room Acoustics
  • Automotive Acoustics and NVH
  • Microacoustics
  • Ultrasound and Nondestructive Testing
  • Aeroacoustics and Flow-Induced Noise
  • Parameter Estimation and Shape Optimization
  • Solvers and Solving Large Models
  • Loudspeakers

“COMSOL Day: Acoustics offers a great opportunity for anyone involved in acoustics product design to see how the industry is benefiting from the use of multiphysics simulation to optimize customer experience, develop new technologies, and create better products,” said Thure Ralfs, managing director of COMSOL A/S and event host. ”Attendees will also see in practice what it takes to build a model from start to finish, within a wide range of application areas.”

The COMSOL Day: Acoustics event dates and start times are as follows:

  • April 28 at 11 a.m. EDT (USA)
  • May 5 at 9 a.m. CEST (Denmark)
  • May 19 at 1 p.m. HKT (China)

These events are open to all, and attendance is free of charge. View COMSOL Day program details. Participation from any region at any of the events is welcomed. Please note that the sessions hosted by the COMSOL offices in the USA and Denmark will be conducted in English, while the event hosted by the office in China will be in Chinese.

COMSOL
www.comsol.com

 


Filed Under: ALL INDUSTRY NEWS • PROFILES • COMMENTARIES
Tagged With: comsol
 

About The Author

Paul Heney

Paul J. Heney, the VP, Editorial Director for Design World magazine, has a BS in Engineering Science & Mechanics and minors in Technical Communications and Biomedical Engineering from Georgia Tech. He has written about fluid power, aerospace, robotics, medical, green engineering, and general manufacturing topics for nearly 25 years. He has won numerous regional and national awards for his writing from the American Society of Business Publication Editors.

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