Design World

  • Home
  • Technologies
    • 3D CAD
    • Electronics • electrical
    • Fastening & Joining
    • Factory automation
    • Linear Motion
    • Motion Control
    • Test & Measurement
    • Sensors
    • Fluid power
  • Learn
    • Ebooks / Tech Tips
    • Engineering Week
    • Future of Design Engineering
    • MC² Motion Control Classrooms
    • Podcasts
    • Videos
    • Webinars
  • LEAP AWARDS
  • Leadership
    • 2022 Voting
    • 2021 Winners
  • Design Guide Library
  • Resources
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Women in Engineering
  • Supplier Listings

Connectivity and Control at the Edge: Sealevel SeaConnect 370

By Taylor Meade | June 5, 2017

Share

The new SeaConnect 370 IoT edge device allows users to monitor and control real-world processes and trigger actions with SeaCloud, a cloud-based, built-in event engine. Ideal for a variety of applications including asset management, data acquisition, environmental monitoring and facility management, the SeaConnect 370 originally emerged as a solution for sign monitoring and notification.

A leader in the sign manufacturing industry approached Sealevel with an innovative idea to offer monitoring services for their clients. With a history of unique solutions for remote I/O, Sealevel welcomed the opportunity to develop a product that could assess environmental conditions and respond accordingly as well as provide historical reporting. Fast forward to today and Sealevel is proud to offer the SeaConnect 370 as a connectivity and control solution.

Key Benefits

  • Ability to configure trigger actions
  • Web configuration accessible by mobile device
  • Integrated Wi-Fi or cellular connectivity

The SeaConnect 370 features two Form C relays, four digital inputs (wet or dry contact), two 12-bit A/D converters, a 1-Wire® bus interface and a TI SimpleLink™ CC3200 ARM Cortex-M4 microcontroller unit. An optional QuickStart Demonstration Kit is available for demonstration and testing purposes.

With integrated Wi-Fi capability, the SeaConnect 370 can also be configured with a Verizon Cat 1 cellular modem. For applications where geolocation is required, the SeaConnect 370 is available with an optional cellular and GPS module.

For data logging, the 370 interfaces with Sealevel’s optional SeaCloud service. SeaCloud offers a secure, robust, scalable, Industrial Internet of Things (IIoT) software platform and is designed to monitor, track, analyze and control data from Sealevel I/O devices. SeaCloud can be private-labeled and customized to meet specific user needs. The current iteration is designed for data-at-rest applications such as condition monitoring and operational intelligence. An additional cloud option is under development for data-in-motion to provide real-time, actionable information.

Other options include dweet.io and custom interfaces to existing customer cloud applications.

The SeaConnect 370 Wi-Fi module starts at $229 and the cellular module starts at $329; select configurations are available from stock. 

Sealevel Systems

www.sealevel.com


Filed Under: I/O modules
Tagged With: sealevel
 

Tell Us What You Think!

Related Articles Read More >

Beckhoff I/O terminal supports high-voltage measurement for renewable energy and EV technologies
Opto 22 releases groov RIO EMU distributed energy monitoring unit
Opto 22 releases new groov EPIC I/O modules for large-scale power monitoring, signal integration
lutze
Overload current-control module features super-thin form factor

DESIGN GUIDE LIBRARY

“motion

Enews Sign Up

Motion Control Classroom

Design World Digital Edition

cover

Browse the most current issue of Design World and back issues in an easy to use high quality format. Clip, share and download with the leading design engineering magazine today.

EDABoard the Forum for Electronics

Top global problem solving EE forum covering Microcontrollers, DSP, Networking, Analog and Digital Design, RF, Power Electronics, PCB Routing and much more

EDABoard: Forum for electronics

Sponsored Content

  • Global supply needs drive increased manufacturing footprint development
  • How to Increase Rotational Capacity for a Retaining Ring
  • Cordis high resolution electronic proportional pressure controls
  • WAGO’s custom designed interface wiring system making industrial applications easier
  • 10 Reasons to Specify Valve Manifolds
  • Case study: How a 3D-printed tool saved thousands of hours and dollars

Design World Podcasts

May 17, 2022
Another view on additive and the aerospace industry
See More >
Engineering Exchange

The Engineering Exchange is a global educational networking community for engineers.

Connect, share, and learn today »

Design World
  • Advertising
  • About us
  • Contact
  • Manage your Design World Subscription
  • Subscribe
  • Design World Digital Network
  • Engineering White Papers
  • LEAP AWARDS

Copyright © 2022 WTWH Media LLC. All Rights Reserved. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media
Privacy Policy | Advertising | About Us

Search Design World

  • Home
  • Technologies
    • 3D CAD
    • Electronics • electrical
    • Fastening & Joining
    • Factory automation
    • Linear Motion
    • Motion Control
    • Test & Measurement
    • Sensors
    • Fluid power
  • Learn
    • Ebooks / Tech Tips
    • Engineering Week
    • Future of Design Engineering
    • MC² Motion Control Classrooms
    • Podcasts
    • Videos
    • Webinars
  • LEAP AWARDS
  • Leadership
    • 2022 Voting
    • 2021 Winners
  • Design Guide Library
  • Resources
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Women in Engineering
  • Supplier Listings