Design World

  • Home
  • Technologies
    • ELECTRONICS • ELECTRICAL
    • Fastening • joining
    • FLUID POWER
    • LINEAR MOTION
    • MOTION CONTROL
    • SENSORS
    • TEST & MEASUREMENT
    • Factory automation
    • Warehouse automation
    • DIGITAL TRANSFORMATION
  • Learn
    • Tech Toolboxes
    • Learning center
    • eBooks • Tech Tips
    • Podcasts
    • Videos
    • Webinars • general engineering
    • Webinars • Automated warehousing
    • Voices
  • LEAP Awards
  • 2025 Leadership
    • 2024 Winners
    • 2023 Winners
    • 2022 Winners
    • 2021 Winners
  • Design Guides
  • Resources
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Educational Assets
    • Engineering diversity
    • Reports
    • Trends
  • Supplier Listings
  • Advertise
  • SUBSCRIBE
    • MAGAZINE
    • NEWSLETTER

Controlling Heat Flow with New Tech

By Purdue University | January 28, 2014

Researchers are proposing a new technology that might control the flow of heat the way electronic devices control electrical current, an advance that could have applications in a diverse range of fields from electronics to textiles.

The concept uses tiny triangular structures to control “phonons,” quantum-mechanical phenomena that describe how vibrations travel through a material’s crystal structure.

Findings in research using advanced simulations show the triangular or T-shaped structures – if small enough in width – are capable of “thermal rectification,” or permitting a greater flow of heat in one direction than in the opposite direction, said Xiulin Ruan, an associate professor in Purdue University’s School of Mechanical Engineering and Birck Nanotechnology Center.

Rectification has made possible transistors, diodes and memory circuits central to the semiconductor industry. The new devices are thermal rectifiers that might perform the same function, but with phonons instead of electrical current.

“In most systems, heat flow is equal in both directions, so there are no thermal devices like electrical diodes. However, if we are able to control heat flow like we control electricity using diodes then we can enable a lot of new and exciting thermal devices including thermal switches, thermal transistors, logic gates and memory,” said Ruan, whose research group collaborated with a group led by Yong Chen, an associate professor in Purdue’s Department of Physics and School of Electrical and Computer Engineering. “People are just starting to understand how it works, and it is quite far from being used in applications.”

Findings are detailed in a research paper that has appeared online in the journal Nano Letters and will be published in an upcoming issue of the journal. The paper was authored by doctoral students Yan Wang, Ajit Vallabhaneni and Jiuning Hu and former doctoral student Bo Qiu; Chen; and Ruan.

The researchers used an advanced simulation method called molecular dynamics to demonstrate thermal rectification in structures called “asymmetric graphene nanoribbons.” Molecular dynamics simulations can simulate the vibrations of atoms and predict the heat flow in a material.

Graphene, an extremely thin layer of carbon, is promising for applications in electronics and computers. The triangular structure must be tiny in width to make possible the “lateral confinement” of phonons needed for the effect. Findings also show thermal rectification is not limited to graphene but could be seen in other materials in structures such as pyramidal, trapezoidal or T-shaped designs.

Hu, Ruan, and Chen also published a paper four years ago in the journal Nano Letters, among the first to propose asymmetric graphene nanoribbons as a thermal rectifier in research using the molecular dynamics simulations. Although numerous studies have been devoted to this topic since then, until now researchers did not know the mechanism behind thermal rectification. The new findings show that this mechanism works by restricting vibrations as they travel through the small lateral direction of an asymmetrical structure.

“We demonstrate that other asymmetric materials, such as asymmetric nanowires, thin films, and quantum dots of a single material can also be high-performance thermal rectifiers, as long as you have lateral confinement,” Ruan said. “This really broadens the potential of this rectification to a much wider spectrum of applications.”

Thermal rectification is not seen in larger triangular-shape structures because they lack lateral confinement. In order for lateral confinement to be produced, the cross section of the structure must be much smaller than the “mean free path” of a phonon, or only a few to hundreds of nanometers depending on the material, Wang said.

“This is the average distance a phonon can travel before it collides with another phonon,” he said.

However, although the devices must be tiny, they could be linked in series to produce larger structures and better rectification performance.

The concept could find uses in “thermal management” applications for computers and electronics, buildings and even clothing.

“For example, on a winter night you don’t want a building to lose heat quickly to the outside, while during the day you want the building to be warmed up by the sun, so it would be good to have building materials that permit the flow of heat in one direction, but not the other,” Ruan said.

A potential, although speculative, future application could be thermal transistors.  Unlike conventional transistors, thermal transistors would not require the use of silicon, are based on phonons rather than electrons and might make use of the large amount of waste heat that is already generated in most practical electronics, said Chen.

You might also like


Filed Under: Rapid prototyping

 

LEARNING CENTER

Design World Learning Center
“dw
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for Design Engineering Professionals.
Motor University

Design World Digital Edition

cover

Browse the most current issue of Design World and back issues in an easy to use high quality format. Clip, share and download with the leading design engineering magazine today.

EDABoard the Forum for Electronics

Top global problem solving EE forum covering Microcontrollers, DSP, Networking, Analog and Digital Design, RF, Power Electronics, PCB Routing and much more

EDABoard: Forum for electronics

Sponsored Content

  • Robot Integration with Rotary Index Tables and Auxiliary Axes
  • How to Choose the Right Rotary Index Table for Your Application
  • Designing a Robust Rotary Index Table: Engineering Best Practices for Long-Term Performance
  • Custom Integration Options for your New and Existing Rotary Table Applications
  • Tech Tips: Crossed Roller Bearing Update
  • Five Uses for the Parvalux Modular Range
View More >>
Engineering Exchange

The Engineering Exchange is a global educational networking community for engineers.

Connect, share, and learn today »

Design World
  • About us
  • Contact
  • Manage your Design World Subscription
  • Subscribe
  • Design World Digital Network
  • Control Engineering
  • Consulting-Specifying Engineer
  • Plant Engineering
  • Engineering White Papers
  • Leap Awards

Copyright © 2026 WTWH Media LLC. All Rights Reserved. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media
Privacy Policy | Advertising | About Us

Search Design World

  • Home
  • Technologies
    • ELECTRONICS • ELECTRICAL
    • Fastening • joining
    • FLUID POWER
    • LINEAR MOTION
    • MOTION CONTROL
    • SENSORS
    • TEST & MEASUREMENT
    • Factory automation
    • Warehouse automation
    • DIGITAL TRANSFORMATION
  • Learn
    • Tech Toolboxes
    • Learning center
    • eBooks • Tech Tips
    • Podcasts
    • Videos
    • Webinars • general engineering
    • Webinars • Automated warehousing
    • Voices
  • LEAP Awards
  • 2025 Leadership
    • 2024 Winners
    • 2023 Winners
    • 2022 Winners
    • 2021 Winners
  • Design Guides
  • Resources
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Educational Assets
    • Engineering diversity
    • Reports
    • Trends
  • Supplier Listings
  • Advertise
  • SUBSCRIBE
    • MAGAZINE
    • NEWSLETTER
We use cookies to personalize content and ads, to provide social media features, and to analyze our traffic. We share information about your use of our site with our social media, advertising, and analytics partners who may combine it with other information you’ve provided to them or that they’ve collected from your use of their services. You consent to our cookies if you continue to use this website.