LISLE, Ill. – Molex Incorporated (NASDAQ: MOLX and MOLXA) and Neoconix have partnered to deliver a flexible, copper-based high-density and speed (HD&S) interposer.
Molex’s Copper Flex assembly with PCBeam interposer includes the following additional features:
· Densities of 1.00mm (.039”) or less in a variety of pin-matrix configurations;
· Board-to-flex pin counts of 500 input/outputs or greater;
· Single-piece compression and tool-less hardware interfaces; as well as
· An impedance matched system that offers 100 Ohm differential and 50 Ohm single-ended options.
PCBeam interposers feature all-metal spring beams that are permanently embedded onto an FR-4 substrate in a high-density configuration. Photolithography and etch are used to define the contact elements, enabling unparalleled design flexibility and true-position accuracy. Typical configurations provide 0.152mm (.006”) of true electrical compliance (TEC) per side at 1.00mm (.039”) pitch to ensure high reliability. An innovative dual-beam option is also available to provide contact redundancy in high-reliability applications.
Copper Flex assemblies with PCBeam interposer are available in flexible cable lengths of 4 to 28 inches for complete design flexibility, and are offered in a variety of thicknesses and custom array of sizes and footprints.
Filed Under: Cables + cable management, Electronics • electrical
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