DesignCon 2017’s schedule of boot camps and tutorials has been released, and the topics range from printed circuit board fabrication to designing 4G and pre-5G requirements.
The chip, board, and systems design conference, which will be held in Santa Clara, Calif., Jan. 31 through Feb. 2, will feature classes, keynote speeches, panels, and the Chiphead Theater, which will take place on the expo floor and showcase educational sessions, two product teardowns, a tour, a panel discussion, and tech trivia.
On Jan. 31, conference-goers can take advantage of boot camps on pragmatic signal integrity and PCB fabrication and materials.
Also on the 31st, tutorials will be offered on designing to evolving 4G and pre-5G requirements, electromagnetic compatibility for PCB design, PAM4 signaling for 56G serial link applications, 32 to 56 GBPS serial link analysis and optimization methods, and more.
“We’re incredibly proud of the combination of educational sessions, training and fun being at DesignCon this year,” said Naomi Price, DesignCon’s content director.
“We welcome a large, diverse audience to our event each year and have compiled an agenda suited to a wide range of individuals to ensure these is something for everyone to learn from and enjoy. Attendees will be given the opportunity to dive into a content-rich event made by engineers for engineers.”
Filed Under: Rapid prototyping
