As the demand for solar energy and electronics increases worldwide, innovative equipment and processes are key elements necessary to increase productivity at lower costs. Leading manufacturers of silicon wafers, the principal raw material used to produce solar panels and computer chips, need high precision, vibration free saws that can cut extremely hard material like silicon, quartz and other friable material.
DoALL Sawing Products recently custom-engineered a series of diamond saws for a silicon ingot production facility. Ingots or boules, whether square or cylindrical, are extremely abrasive, brittle, and expensive to produce. The company developed custom software that instructs a saw blade to enter and exit an ingot slowly, reducing chipping and waste on this expensive material. The large three-axis HDS-1350 saw; D-900 series with rotary or stationary tables; and the model 2012-D12 are serving production facilities across the globe.
The saw blade contains diamond crystals to cut through demanding, raw materials. Diamond saws actually grind the material rather than cut it, which is why diamond saws are effective solutions for handle quartz, glass, carbide, Pyrex, carbon, graphite, gemstones and more.
DoALL Sawing Products
Filed Under: Machine tool industry + subtractive manufacturing, Semiconductor, Energy management + harvesting, Green engineering, Materials • advanced
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