Semiconductor processes, such as atomic layer deposition (ALD), often involve high temperatures or other environmental conditions that cause faster wear on machine components. A new diaphragm valve from Swagelok, though, will resist some of those environmental conditions. Designed for high-temperature processes, the Swagelok® thermal-immersion diaphragm valve features high-speed actuation and is fully immersible at temperatures up to 220° C (428° F). Flow coefficients are up to 0.60.
A fully contained high-purity grade PFA seat ensures compatibility with a range of chemistries, including advanced liquid and solid source materials such as zirconium and hafnium. The seat design also resists swelling and contamination during processing.
With a fully swept flow path, the valves minimize entrapment areas, facilitate purging and maximize flow capacity. The fully swept flow path is a design element shared by the Swagelok thermal-immersion diaphragm valves, DRP series and ALD valves.
The valve body is manufactured from 316L VIM-VAR stainless steel and available with a variety of 1/4 and 3/8 in. end connections, including VCR® and ?H? Type VCR metal gasket face seal fittings, tube butt weld, and modular surface mount. The valves are offered in both pneumatically actuated and manual models. Pneumatically actuated models have valve opening or closing times of less than 5 m. Manual models feature a lockout handle. These diaphragm valves can be incorporated into a variety of platforms, including manifolds, monoblocks, and customized subassemblies.
Swagelok Company
www.swagelok.com
::Design World::
Filed Under: Semiconductor manufacture, Valves, FLUID POWER