API Technologies (Orlando, FL) now offers durable, low pressure overmolded backshells on connector interfaces from its Electromagnetic Integrated Solutions (EIS) product line, the leader in EMI/RFI components and interconnects. This simplified backshell design is readily available and more cost-effective than its metal counterpart. Ideal for use in military, aerospace, high-end industrial, oil and gas, as well as medical applications, these durable, waterproof and weather resistant backshells offer:

• Improved reliability.
• Simplified specification process.
• Superior strain relief, designed to withstand high temperatures and harsh environments.
• Improved insulation between conductors and the conductor shell.

For more information, visit www.apitech.com.