EpoxySet has released the EB-316TC-2, thermally conductive, 2 part epoxy with an easy 1:1 mix ratio. This room temperature curing system offers a very high thermal conductivity of 1.8 W/m° K and can be used continuously at operating temperatures up to 200° C.
It is an excellent choice for bonding, sealing or small encapsulations where thermal management is required.
This semi-rigid system offers excellent vibration and impact resistance and is excellent for thermal cycling from -55° to 200° C. The EB-316TC-2 has a high dielectric K with a high volume resistivity so is a good choice in demanding electronic assemblies requiring both thermal conductivity and electrical insulation. This includes flip chip bonding, glob top encapsulation, and heat sinks for intricate electronic applications.
EB-316TC-2 can be supplied in pint, quart, gallon and pail kits or dual barrel cartridges for easy dispensing.
Filed Under: TECHNOLOGIES + PRODUCTS