Design World

  • Home
  • Technologies
    • 3D CAD
    • Electronics • electrical
    • Fastening & Joining
    • Factory automation
    • Linear Motion
    • Motion Control
    • Test & Measurement
    • Sensors
    • Fluid power
  • Learn
    • Ebooks / Tech Tips
    • Engineering Week
    • Future of Design Engineering
    • MC² Motion Control Classrooms
    • Podcasts
    • Videos
    • Webinars
  • LEAP AWARDS
  • Leadership
    • 2022 Voting
    • 2021 Winners
  • Design Guide Library
  • Resources
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Women in Engineering
  • Supplier Listings

Engineering Academies in the U.S., United Kingdom, and China announce 2017 Global Grand Challenges Summit

By Lisa Eitel | May 22, 2017

Share

The third Global Grand Challenges Summit (GGCS), jointly organized by the U.S. National Academy of Engineering (NAE), the U.K. Royal Academy of Engineering (RAE), and the Chinese Academy of Engineering (CAE), will be held July 18—20, 2017, on the campus of George Washington University in Washington, D.C.

Based on the NAE Grand Challenges for Engineering, the GGCS series aims to spark global collaborations that lead to innovative ways of addressing critically important engineering challenges and opportunities and inspiring the next generation of change makers. Previous summits were held in London and Beijing. The 2017 GGCS will focus on the four themes of the NAE Grand Challenges — sustainability, health, security, and joy of living — as well as education and public engagement. Highlighted topics include virtual reality and artificial intelligence, engineering and health care, climate change, and reverse engineering the brain.

“The NAE Grand Challenges for Engineering are the first global engineering vision for the planet. They inspire us about what engineering needs to contribute to people and society,” said NAE President C.D. Mote, Jr. “The Summit will rouse students’ creativity in their solutions to forge a better future.”

“Engineering has been a critical driving force in the progress of human civilization, and it will play an even more prominent role in addressing the grand challenges facing humankind,” said CAE President Ji Zhou. “Common challenges call for joint efforts. The Summit has become a perfect platform for engineers, the public, and the younger generation from different countries to interact and cooperate on how to address the grand challenges through engineering efforts.”

“The challenges facing our world are not restricted by national boundaries—and neither are the solutions,” said RAE President Dame Ann Dowling. “Engineering is critical to solving these challenges and we see fantastic results when engineers the world over come together to share their expertise, ideas, and innovations. The Global Grand Challenges Summit is a tremendous opportunity to inspire engineers, students, and other members of the public to work together to build a better world.”

A keynote address will be given by Rajiv Shah, recently named president of the Rockefeller Foundation and previous administrator of the United States Agency for International Development (USAID). With more than 20 years of experience in business, government, and philanthropy, Shah is an expert in creating public—private partnerships that support initiatives to improve quality of life throughout the developing world. Speakers will include:

Michael Abrash, chief scientist of Oculus

Deanne Bell, host of CNBC’s “Make Me a Millionaire Inventor”

Dame Sally Davies, chief medical officer for the United Kingdom

Jeffrey Dean, Google senior fellow

Dean Kamen, inventor, entrepreneur, and founder of FIRST Robotics

Christof Koch, president and CSO of the Allen Institute for Brain Science

Rikky Muller, co—founder of Cortera Neurotechnologies and assistant professor of electrical engineering and computer science at UC Berkeley

Molly Stevens, professor of biomedical materials and regenerative medicine at Imperial College London

Ding Yihui, senior advisor of China Meteorological Administration

Wu Zhiqiang, vice president of Tongji University

Representatives from The Boeing Company, the Lockheed Martin Corporation, and the Northrop Grumman Corporation

The Summit will also feature a session highlighting the NAE Grand Challenges Scholars Program — a combined curricular and extracurricular program with five components designed to prepare college students for solving the grand challenges facing society in this century. More than 40 schools across the nation have implemented the program. The session will include both students and educators, and will be moderated by Thomas Katsouleas, provost of the University of Virginia.

In addition, the Summit includes an opportunity for university students to present research posters related to the 14 Grand Challenges. The poster session will provide a chance to network and to brainstorm in small groups.

On July 18, five teams of undergraduate students from each of the host countries will compete in Student Day, presenting ideas and business plans for addressing one or more of the NAE Grand Challenges. Winning teams will receive monetary prizes and be recognized during a special session of the GGCS on July 20. In addition, a panel of representatives from industry will talk about their work focused on the NAE Grand Challenges.

The NAE, RAE, and CAE are hosting the 2017 Summit in conjunction with the inaugural FIRST Global Challenge, at which robotics teams of high school students from nearly 160 countries will compete in a contest on the NAE Grand Challenge to “Provide Access to Clean Water.” They will be tasked with accomplishing an engineering assignment such as the storing of drinkable water, filtering of contaminated water, and procuring of new sources water. The event will take place July 16—18 at DAR Constitution Hall in Washington, D.C. Each year, this event will be held in a different nation’s capital and focus on a new challenge.

The Global Grand Challenges Summit is sponsored by the Lockheed Martin Corporation, The Boeing Company Charitable Trust, the Northrop Grumman Foundation, and Shell Oil Company. Additional information can be found online at www.ggcs2017.org.


The mission of the National Academy of Engineering is to advance the well—being of the nation by promoting a vibrant engineering profession and by marshalling the expertise and insights of eminent engineers to provide independent advice to the federal government on matters involving engineering and technology. The NAE is part of the National Academies of Sciences, Engineering, and Medicine, an independent, nonprofit organization chartered by Congress to provide objective analysis and advice to the nation on matters of science, technology, and health.


Filed Under: Networks • connectivity • fieldbuses, Robotics • robotic grippers • end effectors, Virtual reality

 

About The Author

Lisa Eitel

Lisa Eitel has worked in the motion industry since 2001. Her areas of focus include motors, drives, motion control, power transmission, linear motion, and sensing and feedback technologies. She has a B.S. in Mechanical Engineering and is an inductee of Tau Beta Pi engineering honor society; a member of the Society of Women Engineers; and a judge for the FIRST Robotics Buckeye Regionals. Besides her motioncontroltips.com contributions, she also leads the production of the quarterly motion issues of Design World.

Tell Us What You Think!

Related Articles Read More >

Ethernet/IP Network specification complete for Ethernet-Apl physical layer for process automation
Avnu Alliance launches global TSN Certification program
Hardened multi-speed mega PoE injector for diverse infrastructure applications
EKI-7000 Series Firmware Revision makes network management more secure

DESIGN GUIDE LIBRARY

“motion

Enews Sign Up

Motion Control Classroom

Design World Digital Edition

cover

Browse the most current issue of Design World and back issues in an easy to use high quality format. Clip, share and download with the leading design engineering magazine today.

EDABoard the Forum for Electronics

Top global problem solving EE forum covering Microcontrollers, DSP, Networking, Analog and Digital Design, RF, Power Electronics, PCB Routing and much more

EDABoard: Forum for electronics

Sponsored Content

  • Global supply needs drive increased manufacturing footprint development
  • How to Increase Rotational Capacity for a Retaining Ring
  • Cordis high resolution electronic proportional pressure controls
  • WAGO’s custom designed interface wiring system making industrial applications easier
  • 10 Reasons to Specify Valve Manifolds
  • Case study: How a 3D-printed tool saved thousands of hours and dollars

Design World Podcasts

May 17, 2022
Another view on additive and the aerospace industry
See More >
Engineering Exchange

The Engineering Exchange is a global educational networking community for engineers.

Connect, share, and learn today »

Design World
  • Advertising
  • About us
  • Contact
  • Manage your Design World Subscription
  • Subscribe
  • Design World Digital Network
  • Engineering White Papers
  • LEAP AWARDS

Copyright © 2022 WTWH Media LLC. All Rights Reserved. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media
Privacy Policy | Advertising | About Us

Search Design World

  • Home
  • Technologies
    • 3D CAD
    • Electronics • electrical
    • Fastening & Joining
    • Factory automation
    • Linear Motion
    • Motion Control
    • Test & Measurement
    • Sensors
    • Fluid power
  • Learn
    • Ebooks / Tech Tips
    • Engineering Week
    • Future of Design Engineering
    • MC² Motion Control Classrooms
    • Podcasts
    • Videos
    • Webinars
  • LEAP AWARDS
  • Leadership
    • 2022 Voting
    • 2021 Winners
  • Design Guide Library
  • Resources
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Women in Engineering
  • Supplier Listings