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The revolution in the power systems marketplace has brought a lot of advantages to the electronics industry, with higher power densities, wider input voltage acceptance, and higher conversion efficiency. This is a good thing because the convergence of smart portable devices and the Internet of Things has really put pressure on the designer to create power systems for next-generation systems. Products with increased intelligence need more sophisticated power solutions, in the same or even smaller form factors than before. This increased power density and complexity in the same space also strains the thermal budget to remove any waste heat.
To address the issues of system efficiency and space-constrained power needs, Maxim Integrated’s high-efficiency Himalaya uSLIC power module family has 90 percent peak efficiency, with an integrated inductor to significantly reduce solution size and thermal issues, critical in space-constrained environments.
Filed Under: M2M (machine to machine)