FCI (Singapore) has successfully demonstrated the BERGSTAK 0.8 mm mezzanine connectors’ capability to support PCI Express 3.0 signaling at 8 GT/s. The compact, dual-row BERGSTAK 0.8mm pitch connector series is available in 40 to 200 positions in increments of 20 positions. PCIe 3.0 signal performance is demonstrated up to 10mm stack height. The wide spectrum of circuit sizes and stack heights allows this connector family to support evolving designs and mechanical requirements in a variety of board-stacking applications. Features include:
- Robust blade-on-beam contact design at the mating interface.
- Surface-mount termination at the PCB interface to maximize connection integrity.
- Connector polarization at the mating interface.
For more information, visit www.fci.com.
Filed Under: M2M (machine to machine), Connectors (electrical) • crimp technologies