The Electronics Group of Henkel today announced that it has developed the market’s first-ever extremely low stress thermal interface material that unites thermal conductivity with EMI absorption capabilities. The latest in its line of BERGQUIST GAP PAD products, Henkel’s GAP PAD EMI 1.0 offers electronic specialists critical heat and electromagnetic energy control in a flexible, gap filling product designed to exhibit exceptionally low stress.
GAP PAD thermal interface materials have long been recognized as the market’s most effective gap filling thermal management products. Now, these trusted materials take device protection one step further by integrating electromagnetic energy absorption functionality. With thermal conductivity of 1.0 W/m-K and EMI absorption for frequencies above 1GHz, GAP PAD EMI 1.0 provides robust thermal management control and an added level of EMI protection. GAP PAD EMI 1.0’s improved wet-out at the interface results in thermal performance that is superior to other competitive materials with a similar rating. Thermal conductivity is also enhanced by the material’s natural tack on one side, which eliminates the requirement for any thermally-impeding adhesive layers and also makes component rework simple.
Not only does GAP PAD EMI 1.0 technology offer superb thermal and EMI performance, but the material is the softest and most compliant on the market. Its ability to conform to various topographies and provide a high degree of flexibility ensures exceptionally low stress on solder joints. As compared to traditional, stiffer materials, GAP PAD EMI 1.0 helps improve reliability by reducing in-field failures caused by solder joint stress and fractures.