Fujipoly’s (Carteret, NJ) new Sarcon GR25A-0H2-30GY is a 0.3 mm thick, low thermal resistance interface material with a low-tac surface on both sides. This special treatment reduces material tearing and damage during assembly and rework operations. The new formulation improves cooling performance by filling unwanted air gaps between board components and processors thereby increasing surface contact with a heatsink. Features include:
- A thermal conductivity of 2.8 W/m°K per ASTM D2326.
- A thermal resistance of .21°Cin2/W at 14.5 PSI (1.33°Ccm2/W at 100Kpa)
- Availability in sheets up to 300 x 200 mm.
For more information, visit www.fujipoly.com.
Filed Under: Rapid prototyping