TE Connectivity introduces its new high density plus (HD+) card edge power connectors, which the company says deliver the highest current density of any card edge power connectors available in the market today. Capable of supporting power supplies up to 3kW, these connectors are designed to enable systems with increasing power requirements in next-generation data centers.
TE’s new HD+ card edge connectors deliver current density at 15 A/2.54 mm and support 2,000-3,000 W power supplies for data center equipment. The new connectors have a 1.27 mm signal contact pitch and a 5.08 mm power contact pitch with a working voltage of 60 Vdc.
In addition, TE’s new HD+ card edge power connectors offer very low contact resistance due to a unique dual-layer design of dc power contacts and pass-through pins, which provide multiple mating/contact points to the PCB. Designed in the common industry PCB footprint, these new connectors leverage a compact, cost-effective design with a common power and signal contact module. Designers get a flexible configuration with different contact quantities and can achieve better scalability because the connectors support both ac and dc in low-power and high-power applications. The connectors are ideal for server, switch and mass storage system applications.
“As designers seek to address the need for more power in their data center equipment designs, they need a connector that offers maximum performance and density, and high reliability,” said Bandy Yuan, product manager at TE Connectivity. “TE’s new HD+ card edge power connectors not only support the highest current density among all card edge connectors in the market, but they can offer strong dependability through our dual-layer contact design.”
TE Connectivity Ltd.
www.te.com
Filed Under: Connectors (electrical) • crimp technologies