Visitors to this July’s SEMICON West 2019 trade show will get to learn about where accuracy meets throughput at the HEIDENHAIN and ETEL joint booth in San Francisco in the Moscone Center — July 9 to 11. Here, daily presentations will be given by HEIDENHAIN and ETEL experts highlighting this year’s application focus of Fan-Out Wafer-Level Packaging. This trend demands both a high accuracy and high throughput motion system, especially at the wafer reconstitution process step. In fact, at every wafer level package process step, HEIDENHAIN and ETEL have advanced motion solutions that are ready for the future.
The short presentations will be given three times during each day at 11:00 am, 1:00 pm. and 3 pm at SEMICON West Booth #851. An opportunity to discuss these topics directly with the experts is available after each presentation.
Many state-of-the-art products will also be on display at the HEIDENHAIN-ETEL booth including:
1. ETEL’s TELICA motion system: TELICA is ETEL’s new positioning platform for semiconductor back-end processes as well as the electronics market. This new system will be available for purchase soon; it lets users handle the requirements of next-generation advanced packages with a placement accuracy in the µm range over a working space of up to 870 x 800 mm. That means these positioning platforms can service large panels to panels 720x 650 for very high duty cycles and throughput.
2. NUMERIK JENA LIKgo linear encoder: The LIKgo is a new low-cost linear install with forgiving mounting tolerances thanks to a new scanning technology for significantly improved signal quality. It measures steps down to 78.125 nm.Other advantages and benefits of this new LIKgo include a very small scanning head that weighs only 5 g. The scanning technology is resistant to contamination, thanks to dual scanning windows, and is thus very reliable. The electronics produce little heat due to low current consumption.
3. RSF MCR 15 encoder series: Another new product in the HEIDENHAIN corporate group product portfolio is the MCR 15 absolute modular angle encoder from RSF. Developed for dynamic applications in the semiconductor and electronics industries, this new angle encoder consists of a scanning head and a graduation flange.
The MCR scanning heads are for the available interfaces and graduation-flange outside diameters. They have a measuring range of 360° … and the graduation flanges come in 10 different outside diameters for 59.93 to 350.23 mm.
Dr. Johannes HEIDENHAIN GmbH develops and supports motion control feedback solutions for the machine tool, semiconductor, electronics assembly and test, metrology, automation, medical, energy, biotechnology and other global markets. The North American subsidiary HEIDENHAIN Corp. operates in Schaumburg, Ill. and San Jose and has been serving the U.S. industry for more than 50 years. ETEL S.A. is based in Switzerland with exclusive North American distribution through HEIDENHAIN Corp. For more information, visit www.heidenhain.us.
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