Henkel’s new high-thermal, semi-sintering, die-attach adhesives provide a lead-free alternative for die attach within high-power density semiconductor packages. LOCTITE ABLESTIK ABP 8068T series materials can be implemented using standard processes without the need for high pressure and temperature, as is the case with conventional silver sintering materials.
The new, LOCTITE ABLESTIK ABP 8068T series offer a drop-in replacement solution for standard die-attach applications.
The patent-pending LOCTITE ABLESTIK ABP 8068T portfolio includes high-thermal, semi-sintering, die-attach pastes that offer simplified processing, and best-in-class thermal and electrical performance with robust reliability for today’s high-power density devices.
“Historically, solder has been the predominant solution for high thermal and electrical performance, but its impending phase out due to environmental legislation is driving the need for alternative materials,” said Raj Peddi, Henkel market segment head for Wirebond IC Packaging. “Other approaches, such as conventional high-thermal die-attach adhesives and pure silver sintering products are also less than ideal because of interfacial contact limitations and ‘processability’ challenges.”
Peddi added:” It is for these reasons, Henkel developed the LOCTITE ABLESTIK ABP 8068T series of semi-sintering, die-attach materials which combine high-thermal conductivity, robust reliability, and simplified manufacturing processes.”
Because the novel die-attach pastes form an interpenetrating network of sintered silver (Ag) and resin, they establish excellent contact with the interface for void-free bond lines to achieve outstanding thermal conductivity and result in good thermal-cycling performance. LOCTITE ABLESTIK ABP 8068T series materials are a drop-in replacement solution for standard die-attach applications, can be cured with nitrogen or air, and have robust adhesion on a variety of surface finishes including silver, copper, nickel-palladium-gold, and gold.
Other attributes of LOCTITE ABLESTIK ABP 8068T series materials include:
- Applicability on a wide range of die sizes up to 5 x 5mm
- Excellent thermal performance with bulk thermal conductivity up to 110 W/m-K
- Low in-package resistance of about 0.5 K/W for silver, copper, and nickel-palladium-gold lead frames
- Broad workability that includes consistent dispensing up to 24 continuous hours, open time of two hours and stage time of as long as four hours.
“Truly, for high-power density semiconductor packages, this is the solution manufacturers have been seeking,” says Peddi, noting the material’s combination of performance and reliability. “For packaging specialists that want a lead-free replacement for solder that doesn’t require expensive or complicated processing, yet ensures equal or better performance as compared to conventional materials, the LOCTITE ABLESTIK ABP 8068T portfolio delivers.”
Filed Under: Fastening + joining