Avionics, aerospace, defense electronics, industrial control systems and medical diagnostic equipment have two common requirements for components: they must be small and light weight. The NDD Series of high density, low profile connectors meet all MIL-DTL-32139 specifications, plus they have 0.635 mm pitch contact spacing for high signal density in minimal space.
The nano miniature connectors also use a micro-twist pin arrangement, which features five points of electrical contact and reliable crimp joints to ensure signal integrity and operation in harsh environments.
The high density, low profile connectors withstand vibration up to 20 G and shock up to 100 G, and are tested for 48 hours for salt spray corrosion resistance.
Contact rating for these connectors is 1A, with a maximum contact resistance rating of 71 mV drop. Withstanding voltage is 250 Vac RMS at sea level and 100 Vac RMS at 70,000 ft. High temperature LCP dielectric materials insulate the connectors. Operating temperature ranges from -55°C to +125°C.
The NDD Series connectors can be mounted directly to a PC board with a through-hole mating plug connector. Surface mount versions are in development. Cable harnesses are available in discrete insulated wires, ribbon cable, and flex circuit terminations.
ITT Interconnect Solutions
www.ittcannon.com
Filed Under: Aerospace + defense, Connectors (electrical) • crimp technologies, Electronics • electrical
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