Lisle, Ill.-based Molex will present optical connectivity, structured cabling, and I/O and backplane systems for high-speed, high-density applications at the 29th Annual Supercomputing 2017 international conference and exhibition, being held this week in Denver.
The company will feature high-density blind-mating optical backplane connectors for card, sled and drawer applications, and multi-fiber MT and VersaBeam expanded beam MT ferrule technology to enable faster optical I/O based hardware. By using Molex FlexPlane and Routed Ribbon Solutions, system architects are able to manage fiber counts that range from hundreds to thousands of fibers. Other high-performance I/O products on display include:
• Impel Plus backplane connector system achieves data rates up to 56 Gbps with optimal signal integrity performance. A grounding tail aligner minimizes impedance and reduces crosstalk, while the signal interface improves insertion loss over in-line beams, pushing frequencies past 30 GHz. Backward and forward compatibility meets future data rates without replacing infrastructure.
• High-speed I/O passive copper cable assemblies deliver zQSFP+ off-the- shelf interconnects with data rates up to 100 Gbps. Meeting multiple industry standards, including IEEE 802.3bj, InfiniBand EDR and SAS 3.0 specifications, the assembly incorporates all the necessary components of a complete I/O solution from one supplier. Molex and Intel will showcase an Intel Omni-Path Switch that incorporates many different Molex high-speed copper cable connectors and cages to provide Intel with a full service offering.
• zCD interconnect system supports next-generation 400 Gbps per-serial-lane Ethernet network data transmission applications with excellent signal integrity, electromagnetic interference protection and thermal cooling. Currently being defined by the CDFP MSA consortium, the zCD connector reportedly offers the densest, fastest interconnect on the market.
• Impulse orthogonal direct backplane connector delivers credible performance and density at a lower applied cost, with improved airflow and cost savings by eliminating the need to build and install midplane connections. Designed for high-density data center applications, the Impulse connector system supports data rates of 56 Gbps NRZ and 112 Gbps PAM-4 with superior signal integrity.
• Oplink 10-100G pluggable transceivers handle distances up to 80 km, supporting data rates up to 100 Gbps in datacom and storage area network applications.
• Quad Small Form-factor Pluggable Double Density (QSFP-DD) System is designed for high-density, high-speed networking applications in enterprise environments. The eight-lane electrical interface operates up to 25 Gbps NRZ modulation or 50 Gbps PAM-4 permitting up to 200 Gbps NRZ or 400 Gbps PAM-4 aggregate per QSFP-DD port and supporting modules with up to 12-W power ratings.
“At Molex, we are dedicated to providing optimal signal speed, design flexibility and scalability to propel next-generation system architecture solutions,” said Jay Neer, industry standards manager. “We are delighted to showcase these innovative, proven solutions.”
Filed Under: Cables + cable management, Connectors (electrical) • crimp technologies, Networks • connectivity • fieldbuses