Sensor suppliers make cloud connectivity easier and faster by offering special design kits and tools. For example, STMicroelectronics recently launched SensorTile.box, STEVAL-MKSBOX1V1, so users can easily collect and send sensor information to the cloud. With Bluetooth^® Low Energy connectivity to a smartphone, the multi sensor kit allows the design of wireless IoT and wearable sensor applications quickly and easily, without performing any programming. Using Microsoft Azure IoT Central on Microsoft Azure, the kit provides connectivity for a variety of ST sensors including:

• STTS751 high-accuracy temperature sensor
• LSM6DSOX low-power 6-axis inertial measurement unit (IMU) with Machine Learning Core (MLC)
• LIS3DHH and LIS2DW12 3-axis accelerometers
• LIS2MDL magnetometer
• LPS22HH pressure sensor/altimeter
• MP23ABS1 analog microphone
• HTS221 humidity sensor

The kit shows how sensors can be configured and data transmitted for sensors functions such as a pedometer, asset tracker, environmental monitor, or as other instruments.

Other companies provide their approach to simplify and expedite sensor connectivity, too. With its IEI TANK* AIoT Developer Kit, Intel customers can build a motor defect detector using machine learning models to help detect irregularities in machine vibration and predict these faults in a motor ball bearing data set. With the kit data can be process locally using the scikit-learn library and then sent to the cloud for aggregation and viewing. Other reference implementations using the kit include a store aisle monitor and a facial recognition access application. Reduced time to market and simplified software development are achieved using preloaded tools including Intel® System Studio and Arduino Create. Typical industrial use cases for the kit include: factory automation, warehouse management, intelligent energy management and machine vision.