Design World

  • Home
  • Technologies
    • 3D CAD
    • Electronics • electrical
    • Fastening & Joining
    • Factory automation
    • Linear Motion
    • Motion Control
    • Test & Measurement
    • Sensors
    • Fluid power
  • Learn
    • Ebooks / Tech Tips
    • Engineering Week
    • Future of Design Engineering
    • MC² Motion Control Classrooms
    • Podcasts
    • Videos
    • Webinars
  • LEAP AWARDS
  • Leadership
    • 2022 Voting
    • 2021 Winners
  • Design Guide Library
  • Resources
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Women in Engineering
  • Supplier Listings

IMAPS Gives Details of MicroTech Conference

By atesmeh | February 23, 2010

Share

(AP) — IMAPS-UK (The International Microelectronics And Packaging Society) is
pleased to announce details of the forthcoming MicroTech-2010 Conference
featuring “Disruptive Technologies” & APM featuring “Advanced Polymer,
Organic & Inorganic Materials” being held at the well known Cambridge
University Møller Centre. The location is ideally placed near many of the
forward thrusting new and established companies as well as at a great historic
city.

The Conference
will be the major spring 2010 event on Electronics Packaging, Interconnection
and Integration in Europe and is being held between 28th February and 2nd March
2010.

The event has
also attracted worldwide interest and features an exceptional technical
programme, with speakers providing Keynotes and contributions from USA, Korea,
China and across mainland Europe.

Keynote presentations for MicroTech include “Disruptive
Technologies” by Mark Christensen of Prismark Partners, USA; “MEMS packaging and
assembly in Harsh Environments” by Sean Neylon of Colibrys, Switzerland. APM
Keynote presentations include “Reliability study for high temperature stable
conductive adhesives” by Johan Liu of EMIT Centre, Gothenburg, Sweden; “Wafer
Level CSP & FlipChip Production Technology” by Elke Zakel of PacTech,
Berlin, Germany and “Single Sided Substrates and Packages Based on Laminate
Materials” by Bernd Appelt of ASE, USA. Further details of the full Technical
Programme can be downloaded off the IMAPS-UK website.

A free to visit
“Table-Top” exhibition will also span both Conference events. The exhibition
provides an excellent opportunity to view the latest products and services from
leading Companies involved in the Microelectronics field and for exhibitors to
market their products and services to a wide-ranging audience.

Further details of the
conference can be obtained by visiting the IMAPS-UK website www.imaps.org.uk or
by emailing the Societies Secretariat: [email protected]


Filed Under: Aerospace + defense, Industrial automation

 

Related Articles Read More >

Ontic acquires Servotek and Westcon product lines from Marsh Bellofram
Flexible rotary shafts support thrust reverser on 150 LEAP 1-A turbofan engines
Drone-mounted inspection breaks barriers for F-35
TriStar, a misunderstood failure of design

DESIGN GUIDE LIBRARY

“motion

Enews Sign Up

Motion Control Classroom

Design World Digital Edition

cover

Browse the most current issue of Design World and back issues in an easy to use high quality format. Clip, share and download with the leading design engineering magazine today.

EDABoard the Forum for Electronics

Top global problem solving EE forum covering Microcontrollers, DSP, Networking, Analog and Digital Design, RF, Power Electronics, PCB Routing and much more

EDABoard: Forum for electronics

Sponsored Content

  • Global supply needs drive increased manufacturing footprint development
  • How to Increase Rotational Capacity for a Retaining Ring
  • Cordis high resolution electronic proportional pressure controls
  • WAGO’s custom designed interface wiring system making industrial applications easier
  • 10 Reasons to Specify Valve Manifolds
  • Case study: How a 3D-printed tool saved thousands of hours and dollars

Design World Podcasts

May 17, 2022
Another view on additive and the aerospace industry
See More >
Engineering Exchange

The Engineering Exchange is a global educational networking community for engineers.

Connect, share, and learn today »

Design World
  • Advertising
  • About us
  • Contact
  • Manage your Design World Subscription
  • Subscribe
  • Design World Digital Network
  • Engineering White Papers
  • LEAP AWARDS

Copyright © 2022 WTWH Media LLC. All Rights Reserved. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media
Privacy Policy | Advertising | About Us

Search Design World

  • Home
  • Technologies
    • 3D CAD
    • Electronics • electrical
    • Fastening & Joining
    • Factory automation
    • Linear Motion
    • Motion Control
    • Test & Measurement
    • Sensors
    • Fluid power
  • Learn
    • Ebooks / Tech Tips
    • Engineering Week
    • Future of Design Engineering
    • MC² Motion Control Classrooms
    • Podcasts
    • Videos
    • Webinars
  • LEAP AWARDS
  • Leadership
    • 2022 Voting
    • 2021 Winners
  • Design Guide Library
  • Resources
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Women in Engineering
  • Supplier Listings