Broomfield, CO – Spatial Corp. announces the availability of the EDA 3D Analysis Suite which enables rapid development of 3D analysis and visualization features within current EDA physical design flows. The software component suite provides unique productivity and time-to-market (TTM) advances to tool developers with an integrated set of modeling, visualization and meshing utilities accessible through a unified API, streamlining development while eliminating much of the need to understand 3D geometry modeling.
EDA applications benefiting from 3D analysis include high frequency board and package signal integrity, embedded memory and passive component characterization, lithographic and CMP analysis, parasitic extraction, thermal and mechanical stress, and process modeling. Prior to the availability of the EDA 3D Analysis Suite, most commercial and internal EDA tool developers were faced with integrating their proprietary solvers into EDA applications with a combination of university and open source software, point tools and internally developed utilities-while having limited staff with expertise in 3D geometry modeling.
Spatial’s EDA 3D Analysis Suite bridges the gap between 2D EDA physical databases and the input requirements of 3D solvers. The integrated software package is linked into EDA applications through a unified API that supports:
– 2.5D and 3D solid model creation and simplification
– Surface and solid meshing routines with robust meshing controls
– Platform-independent, high performance 3D display management
Filed Under: Software
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