(FRANKFURT, Germany) – As vehicles’ electrical content increases and packaging space decreases Waferized joint connectors, a component of Delphi Corporation’s E/E architecture system, enable miniaturization where space is at a premium.
Built from a number of smaller components, Delphi’s waferized joint connection systems use just three or four terminal cavities versus the traditional method of using ten or more cavities per harness.
“Using a smaller wafer in a joint connector allows us to be more efficient in our electrical system design…” Dave Wright, global director, innovation & E/E architecture, Delphi Packard E/EA, said.
These connectors work independently of each other and have integrated secondary terminal locks, making the assembly process more flexible and less complex. Fewer wafers can be used in the overall wiring harness design, they do not need to be assembled in sequence, and a single wafer can be removed without disturbing other terminals.
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Filed Under: Automotive, Connectors (electrical) • crimp technologies