Keynote Speaker Announced for 2013 3D Collaboration & Interoperability Congress

Longview Advisors, organizers of the annual Collaboration & Interoperability Congress (CIC), has announced the keynote speaker for its 2013 event (www.3DCIC.com) to be held May 21-23, 2013 in Colorado Springs, Colorado.

Thomas Kurfess, Assistant Director for Advanced Manufacturing at the Office of Science and Technology Policy in the Executive Office of the President of the United States of America, will present “A Roadmap for Impact: Driving Innovation in the New Age of Manufacturing.” Professor Kurfess will discuss the impact of manufacturing on innovation, and the policies, initiatives and opportunities upon which the economic engine of America can ensure the economic prosperity and national security of the nation and the globe. Professor Kurfess has been at the White House since February 2012 and is responsible for engaging the federal sector and the greater scientific community to identify possible areas for policy actions related to manufacturing. He is responsible for coordinating federal advanced manufacturing R&D, addressing issues related to technology commercialization, identifying gaps in current federal R&D in advanced manufacturing, and developing strategies to address these gaps. He is on leave for one year from his position as Professor of Mechanical Engineering at the Georgia Institute of Technology.

Now in its tenth year, CIC has become a yearly barometer of the state of collaboration and interoperability strategy, technology and solutions in manufacturing and business communications. The three-day international event gives attendees a unique opportunity to network, learn and strategize with thought leaders from many sectors of discrete manufacturing, including automotive, aerospace, heavy equipment and electronics industries, as well as with representatives from government and defense communities.

Conference organizers are pleased to announce that NASA/ESA (European Space Agency) is merging with CIC and will hold its14th annual product data exchange meeting at CIC 2013 and thereafter. In addition, the PDES Board of Directors will again hold its annual meeting at CIC this year, and the 3D PDF consortium will be holding its second annual meeting at CIC 2013.

Interested attendees are encouraged to register soon as time-limited discounts currently apply.

For more information visit www.3dcic.com.