Rogers Corporation’s Advanced Connectivity Solutions (ACS) brings its advanced circuit materials and material technology to Boston, contributing to both the technical conference and the exhibition floor. Rogers ACS offers materials for RF, microwave, millimeter-wave and high speed digital circuits.
Network equipment designers require high performance circuit materials with superior electrical properties for applications like IP infrastructure, High Performance Computing and Test and Measurement. Rogers RO1200 circuit materials are engineered to meet the unique electrical and thermal/mechanical demands of high-speed designs, helping to maximize data throughput and minimize latency. With a low dielectric constant (Dk) of 3.05, and a maximum dissipation factor of 0.0017 @10 GHz, RO1200 laminates provide outstanding signal integrity (SI), reduced signal skew, and reduced cross-talk. Combined with superior thermal/mechanical performance, low CTE, and a halogen-free UL 94 V-0 rating, RO1200 laminates are well suited for the most demanding high-layer-count applications.
CLTE-MW & CLTE-AT™ Laminates
Rogers CLTE-MW laminates are ceramic-filled, PTFE-based, woven-glass-reinforced composite materials that optimize cost and performance for the circuit designer. They are made using a spread fiberglass cloth reinforcement coupled with high filler loading to minimize high-frequency glass weave effects on electromagnetic wave propagation. CLTE-MW laminates serve markets in commercial and consumer through industrial and military applications, including amplifiers, antennas, couplers, and filters. Available thicknesses from 3 to 10 mils support the signal-to-ground spacing needed for today’s millimeter-wave designs.
CLTE-AT laminates use micro-dispersed ceramic in a PTFE-based, woven-glass-reinforced composite material and were developed to optimize the cost to performance ratio. CLTE-AT laminate building blocks are similar to CLTE-XT™ laminates and share many common benefits. Building on a 5 mil structure, this allows for consistent dielectric constant regardless of thickness. They are used in Amplifiers, Baluns, Couplers and Filters. CLTE-AT laminates serve a range of markets from Commercial and Consumer through Defense and Space.
5-mil-thick RO3003 laminates are ideal for loss-critical millimeter wave frequency designs where consistent circuit performance matters, such as automotive radar sensors and point-to-point microwave backhaul-communications systems. While already a benchmark for 77-GHz automotive radar sensors, RO3003 laminates feature a Dk of 3.0 and are available with 0.5- and 1-oz. rolled copper foil. They combine the very low dielectric loss of RO3003 PTFE-ceramic resin system with smooth foil resulting in high-frequency circuit materials with best-in-class insertion loss.
Rogers RO4835 laminates can be used for applications demanding greater stability at elevated temperatures and requiring more resistance to oxidation than standard RF thermoset materials. As part of the RO4000® hydrocarbon ceramic laminate family, RO4835 laminates offer superior high-frequency performance and low cost circuit fabrication, resulting in a low-loss material which can be fabricated using standard, low-cost epoxy/glass (FR-4) processes. RO4835 laminates utilize RoHS compliant flame-retardant technology for applications requiring UL 94 V-0 certification.
RO4835 laminates are available with Rogers’ proprietary LoPro® reverse treat copper foil. These materials are ideal for applications requiring low loss insertion characteristics. LoPro foil provides reduced electrical variability due to its smoother copper surface, maintaining consistent performance for reliable broadband signal integrity from Digital through RF and microwave frequencies.
Circuits for the Classroom
As part of the EDI CON 2017 High-Speed Digital Symposium, Rogers’ Research Fellow Allen Horn III will present “Extraction of Frequency-Dependent Dielectric Constant: Loss and conductor effects of high-speed digital laminate materials for high-speed channel simulation,” a presentation co-authored by Chris Caisse and Patricia LaFrance, also of Rogers Corp.
The Tuesday afternoon (1:00 P.M., Room 111) session will explore the different approaches used to create models of circuit materials for software simulation tools, in particular for predicting different circuit phenomena in high-speed digital circuits. The conference format includes an interactive panel which invites questions from the audience.
Filed Under: M2M (machine to machine)