Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for Multi Chip Memory Package – CBT-BGA-6073. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 125,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss < 1 dB at 15.7 GHz and contact resistance is <30mOhms. The current capacity of each contactor is 4 amps at 60C temperature rise. Socket temperature range is -55C to +180C. Socket also features a floating guide for precise ball to pin alignment. The specific configuration of the package to be tested in the CBT-BGA-6073 is a BGA, 20x15mm, 0.8mm pitch, 252 position, 23×17 ball array. The socket is mounted using supplied hardware on the target PCB with no soldering, and uses smallest footprint for nearby passive components. Socket uses 5 post stiffener plate to support back side of the PCB and allows passive components to be placed in between posts. This socket utilizes clamshell lid with integrated compression mechanism. The socket is constructed with cam actuated lever lid with central opening for direct thermal characterization of silicon. To use, place the device inside the socket, close the clamshell lid by latching and apply downward pressure by turning lever. This socket can be used for hand test and temperature characterization as well as debugging application in development and MCP comparison between various manufacturers.
Pricing for the CBT-BGA-6073 is $972 at qty 1 with reduced pricing available depending on quantity required.
1335 Eagandale Court
Eagan, MN 55121
Filed Under: Industrial automation