Low-Profile Copper Cable for QSFP Assemblies

Landenberg, PA – W. L. Gore & Associates, Inc. (Gore) announces general availability of a very low-profile QSFP direct attach copper cable assembly that is “fiber-like” in size for QDR InfiniBand and 40 GbE aggregate applications. GORE™ Low-Profile Copper Cable fulfills the needs of dense, higher-port-count switch installations while providing an even more reliable interconnect for high-performance computing (HPC). This cable was provided to major switch vendors and computing OEMs for testing over the last 6-8 months and was tested for compliance and interoperability in spring 2009.

GORE™ Low-Profile Copper Cable was developed for GORE™ QSFP Assemblies and InfiniBand QDR applications. With a diameter of 0.170″ for a 4x channel, 8-pair cable, the cross-section savings is 37% compared to alternative Gore cables and 58% compared to typical industry offerings. This low-profile cable is targeted at high-performance computing applications, where a large percentage of high-density port-count interconnects are 2 meters or less (e.g., in top-of-the-rack switching installations).

The reduced bend radius and smaller diameter of GORE™ Low-Profile Cable allows for more aggressive routing as well as cleaner dressing of the cables in high-performance computing (HPC) environments. This new cable is also less prone to interfere with the closing of cabinet doors in dense environments.

Gore has taken advantage of the superior electrical properties of their proprietary low-loss expanded PTFE, known by the GORE-TEX® brand in the fabrics market. The extremely low dielectic constant (1.3) of ePTFE, allows Gore to provide smaller diameter cables with the same 10 Gbps electrical performance of larger OD cables.

W. L. Gore & Associates, Inc.
www.gore.com/highspeed

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