Master Bond, a manufacturer of epoxy adhesives, sealants, coatings, has compiled its top adhesives, which were developed and launched this year. The formulas include a mix of low-outgassing, silver-filled, and and thermally conductive options, depending on the application.
Click here for a full list of Master Bond’s products.
1. EP21NS, a nanosilica-filled epoxy system with a one-to-one mix ratio by weight. Upon mixing, it has moderate viscosity and good flow properties, with excellent physical strength properties. It’s formulated to cure at room temperature or more rapidly at elevated temperatures.
EP21NS bonds well to a wide variety of materials including metals, composites, glass, ceramics, rubbers and many plastics.
Features
- Convenient mix ratio
- Exceptionally low shrinkage upon curing
- Outstanding dimensional stability
- Extraordinary electrical insulation properties
2. Supreme 70CN is a moderate viscosity, toughened epoxy for high-performance bonding, sealing, coating, and potting. It cures readily at ambient temperatures and more rapidly at elevated temperatures. Supreme 70CN bonds well to a wide variety of substrates including metals, ceramics and many rubbers, plastic materials, and especially composites.
An important feature is its toughness, which allows it to be used for bonding dissimilar substrates and to withstand thermal cycling.
Features
- Moderate viscosity
- Superior chemical resistance
- Black colored, optically opaque
- NASA low-outgassing
3. MasterSil 153AO is a two-component silicone for high-performance bonding and sealing, containing no solvents or diluents. It cures at ambient temperature or more rapidly at elevated temperatures and has low shrinkage upon curing. This silicone adhesive bonds well to a wide variety of substrates such as metals, glass, ceramics, and many plastics. Moreover, it bonds tenaciously to silicone rubber.
Features
- Paste consistency
- Long open time
- High-temperature resistant
- Remarkable adhesive properties
4. EP30-4Med is an optically clear, two-component epoxy system for high-performance bonding, coating, sealing, and casting. Upon mixing, this low viscosity system cures rapidly at room temperature and the cure can be accelerated with heat. It is a relatively fast setting system.
EP30-4Med bonds well to a variety of substrates including metals, composites, ceramics, glass, and many rubbers and plastics. It also offers superb electrical insulation properties.
Features
- Low viscosity
- Fast curing, even in thin sections
- Superior non-yellowing properties
- Passes ISO 10993-5
5. EP3HTS-TC is a fast-curing, silver-filled, one-part epoxy with unparalled electrical and thermal conductivity. It cures rapidly with minimal flow and low shrinkage. Although this product can be used for sealing and coating, its main use is as an adhesive for die attach and general bonding purposes. It bonds well to a wide variety of substrates including metals, composites, ceramics, and many plastics.
Features
- For bonding, sealing, and coating
- Not premixed and frozen
- Very long open time at room temperature
- Cures rapidly at 250- 300° F
6. EP5G-80 is a one component, graphite-filled epoxy paste for bonding, sealing, and coating applications. It’s electrically and thermally conductive. The system has outstanding physical strength properties, stellar dimensional stability and low shrinkage — with an unlimited working life at room temperature.
EP5G-80 bonds well to a wide variety of substrates such as metals, composites, ceramics, and many plastics. It has a remarkably high tensile modulus and compressive strength.
Features
- Good electrical and thermal conductivity
- Thixotropic paste
- Not premixed and frozen
- NASA low-outgassing
Filed Under: Adhesives • epoxies