Design World

  • Home
  • Technologies
    • ELECTRONICS • ELECTRICAL
    • Fastening • joining
    • FLUID POWER
    • LINEAR MOTION
    • MOTION CONTROL
    • SENSORS
    • TEST & MEASUREMENT
    • Factory automation
    • Warehouse automation
    • DIGITAL TRANSFORMATION
  • Learn
    • Tech Toolboxes
    • Learning center
    • eBooks • Tech Tips
    • Podcasts
    • Videos
    • Webinars • general engineering
    • Webinars • Automated warehousing
    • Voices
  • LEAP Awards
  • 2025 Leadership
    • 2024 Winners
    • 2023 Winners
    • 2022 Winners
    • 2021 Winners
  • Design Guides
  • Resources
    • Subscribe
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Engineering diversity
    • Trends
  • Supplier Listings
  • Advertise
  • Subscribe

Master Bond’s new toughened UV-curable adhesive cures rapidly

By Rachael Pasini | April 22, 2025

Master Bond UV15-7HP is a low-viscosity, easy-to-apply, one-part, UV-curable adhesive system. Optimal adhesion is achieved in bond line thicknesses of 0.001 to 0.003 in., and it can cure rapidly with a minimum intensity of 20 to 40 mW/cm2 using a UV light source emitting at a wavelength of 320 to 365 nm. The material can also be cured in sections up to 0.125 in. thick under appropriate conditions, making it suitable for bonding, sealing, coating, and encapsulation.

UV15-7HP bonds well to a wide variety of substrates, including glass, ceramics, metals, and many plastics, such as polycarbonates, acrylics, and polyester films. Image: Master Bond

The UV15-7HP has a tensile strength of 6,000 to 7,000 psi and a tensile modulus of 250,000 to 300,000 psi at room temperature. This toughened system resists thermal cycling and offers significant elongation of 5 to 10%. It is an electrically insulative material with a volume resistivity greater than 1,014 ohm-cm. Optically clear with a refractive index of 1.54 at 589 nm, it is not oxygen inhibited and contains no solvents or diluents.

This UV-curable adhesive bonds well to a wide variety of substrates, including glass, ceramics, metals, and many plastics, such as polycarbonates, acrylics, and polyester films. The system is serviceable in a wide range of temperatures, from -80 to 300° F. It is available in various packaging options: 10 cc and 30 cc syringes, ½ pints, pints, quarts, gallons, and five-gallon containers.

The company’s UV curing product line includes ultra-fast curing compounds suitable for diverse bonding, sealing, and coating applications within the optical, fiber optic, electronic, laser, and semiconductor industries. Certain UV grades meet NASA low outgassing or USP Class VI and ISO 10993-5 standards and are used in the aerospace and medical industries, respectively.

Learn more by visiting masterbond.com/products/uv-curable-systems.

You Might Also Like


Filed Under: Aerospace + defense, Adhesives • epoxies, Semiconductor manufacture, Medical-device manufacture
Tagged With: masterbond
 

About The Author

Rachael Pasini

Rachael Pasini has a master’s degree in civil and environmental engineering and a bachelor’s degree in industrial and systems engineering from The Ohio State University. She has over 15 years of experience as a technical writer and taught college math and physics. As Editor-in-Chief of Design World and Engineering.com, and Senior Editor of Fluid Power World and R&D World, she covers automation, hydraulics, pneumatics, linear motion, motion control, additive manufacturing, advanced materials, robotics, and more.

LEARNING CENTER

Design World Learning Center
“dw
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for Design Engineering Professionals.
Motor University

Design World Digital Edition

cover

Browse the most current issue of Design World and back issues in an easy to use high quality format. Clip, share and download with the leading design engineering magazine today.

EDABoard the Forum for Electronics

Top global problem solving EE forum covering Microcontrollers, DSP, Networking, Analog and Digital Design, RF, Power Electronics, PCB Routing and much more

EDABoard: Forum for electronics

Sponsored Content

  • Sustainability, Innovation and Safety, Central to Our Approach
  • Why off-highway is the sweet spot for AC electrification technology
  • Looking to 2025: Past Success Guides Future Achievements
  • North American Companies Seek Stronger Ties with Italian OEMs
  • Adapt and Evolve
  • Sustainable Practices for a Sustainable World
View More >>
Engineering Exchange

The Engineering Exchange is a global educational networking community for engineers.

Connect, share, and learn today »

Design World
  • About us
  • Contact
  • Manage your Design World Subscription
  • Subscribe
  • Design World Digital Network
  • Control Engineering
  • Consulting-Specifying Engineer
  • Plant Engineering
  • Engineering White Papers
  • Leap Awards

Copyright © 2025 WTWH Media LLC. All Rights Reserved. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media
Privacy Policy | Advertising | About Us

Search Design World

  • Home
  • Technologies
    • ELECTRONICS • ELECTRICAL
    • Fastening • joining
    • FLUID POWER
    • LINEAR MOTION
    • MOTION CONTROL
    • SENSORS
    • TEST & MEASUREMENT
    • Factory automation
    • Warehouse automation
    • DIGITAL TRANSFORMATION
  • Learn
    • Tech Toolboxes
    • Learning center
    • eBooks • Tech Tips
    • Podcasts
    • Videos
    • Webinars • general engineering
    • Webinars • Automated warehousing
    • Voices
  • LEAP Awards
  • 2025 Leadership
    • 2024 Winners
    • 2023 Winners
    • 2022 Winners
    • 2021 Winners
  • Design Guides
  • Resources
    • Subscribe
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Engineering diversity
    • Trends
  • Supplier Listings
  • Advertise
  • Subscribe